Patents Assigned to AE CO., LTD.
  • Purge nozzle module for load port
    Patent number: 11201072
    Abstract: A purge nozzle module for supplying nitrogen (N2) to a semiconductor wafer processing apparatus includes a nozzle body with a purge hole formed at a center thereof, and a vacuum pad combined with an upper side of the nozzle body, having a through hole connected to the purge hole formed therethrough, and making close contact with a bottom of a FOUP (Front Opening Unified Pod) by a vacuum pressure.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: December 14, 2021
    Assignee: AE CO., LTD.
    Inventors: She Hyun Oh, Joung Youn Kim