Patents Assigned to AEG-Isolier-und Kunststoff GmbH
  • Epoxy resin formulation having an extremely short hardening time for the production of epoxy glass laminates in continuously operating double-belt presses
    Patent number: 4912190
    Abstract: An epoxy resin composition, including epoxy resin, cyanamide as a hardener, and 2-methylimidazole or 2,4-ethyl-methylimidazole as an accelerator in hardening the epoxy resin.
    Type: Grant
    Filed: May 6, 1988
    Date of Patent: March 27, 1990
    Assignee: AEG Isolier- Und Kunststoff GmbH
    Inventor: Hans-Jurgen Schafer
  • Adhesion imparting layer of acrylonitrile-butadiene copolymer on a base material for printed circuits
    Patent number: 4212912
    Abstract: Adhesion imparting layer applied to an insulating material serving as a base material in the production of printed circuit boards. The adhesion imparting layer consists essentially of an elastomer of acrylonitrile-butadiene copolymer cross-linked with an organic peroxide.
    Type: Grant
    Filed: March 15, 1977
    Date of Patent: July 15, 1980
    Assignees: Licentia Patent-Verwaltungs-G.m.b.H., AEG Isolier- und Kunststoff GmbH
    Inventors: Johann Wartusch, Helmut Fasbender
  • Process for manufacturing base material for printed circuits
    Patent number: 3948701
    Abstract: In a process for making a printed circuit, a method of forming a base for the circuit, including coating a cover foil with a decomposable film, then bonding the film to a carrier, and then removing the cover foil from the film.A protected base useful for making printed circuits, comprising a synthetic-resin-based carrier, a decomposable adhesive film bonded to the carrier, and a removable cover foil bonded to the film, the adhesive film containing catalyst effective for the electroless deposition of metal conductors.
    Type: Grant
    Filed: October 2, 1974
    Date of Patent: April 6, 1976
    Assignee: AEG-Isolier-und Kunststoff GmbH
    Inventors: Helmut Fasbender, Horst Hirschfeld