Abstract: A device for thermal testing one or more exposed or covered dies of an integrated circuit and a thermal tester for testing one or more exposed or covered dies of an integrated circuit on a testing platform are provided. The device for thermal testing the one or more exposed or covered dies of the integrated circuit includes a pedestal and a heatlet attached to a first end of the pedestal. The heatlet includes a face comprising one or more plates. The one or more plates are configured to match a geometry of the one or more dies. The heatlet also includes heating circuitry configured in operation to heat the one or more plates of the face and sensing circuitry configured in operation to sense a temperature of the heatlet.

Abstract: Disclosed herein are systems and methods comprising a thermal control wafer (TCW) comprising a plurality of heater zones. A heater zone may comprise a heater-sensing element that generates heat during a heating mode and provides a resistance during a sensing mode. During testing, a wafer under test (WUT) may be placed on top of a chuck assembly. The TCW may be part of or separate from the chuck assembly. Controlling one or more heater zones on the TCW may control the temperatures of DUT(s) while being tested. The thermal controller may comprise a plurality of thermal control channel multiplexed to a plurality of heater zones. E.g., one or more first heater zones can be activated at a first time, one or more second heater zones can be activated at a second time, one or more third heater zones can be activated at a third time, etc.

Abstract: Disclosed herein is an integrated heater and measurement (IHM) device comprising heating-sensing element(s) and heating-sensing circuit(s). A heating-sensing element generates heat and determines the temperature of the IHM device. In some embodiments, the heating-sensing element may operate in a plurality of modes: heating mode, sensing mode, and/or off mode. A controller may dynamically adjust the properties of the operation mode and/or time periods based on the determined temperature. The adjusted properties may include the duration of the heating mode, the ON time for a heating-sensing element, etc. The controller may adjust the duration of heating mode based on the temperature difference between the determined temperature and a set point temperature, such as decreasing the duration of the heating mode when there is a low temperature difference, and increasing the duration of the heating mode when there is a high temperature difference.

Abstract: Disclosed herein are systems and methods comprising a thermal control wafer (TCW) comprising a plurality of heater zones. A heater zone may comprise a heater-sensing element that generates heat during a heating mode and provides a resistance during a sensing mode. During testing, a wafer under test (WUT) may be placed on top of a chuck assembly. The TCW may be part of or separate from the chuck assembly. Controlling one or more heater zones on the TCW may control the temperatures of DUT(s) while being tested. The thermal controller may comprise a plurality of thermal control channel multiplexed to a plurality of heater zones. E.g., one or more first heater zones can be activated at a first time, one or more second heater zones can be activated at a second time, one or more third heater zones can be activated at a third time, etc.

Abstract: Disclosed herein are systems and methods for controlling temperature(s) using a thermal control assembly (TCA) and a coldplate. The TCA comprises independently controllable thermal zones for controlling its top surface temperature. The thermal zones may be heater zones, cooling zones, or both. Energy input to the TCA may be selectively applied by, e.g., a thermal controller, such that different sets of thermal zones receive the energy at different times. In some embodiments, the energy input to the TCA may be selectively applied to two more independently controllable heater zones at the same time, the energy input to the TCA may be selectively applied to two or more independently controllable cooling zones at the same time, or both. In some aspects, less than all thermal zones may be activated at the same time, providing a higher power density for the thermal zones for a given energy input to the TCA.

Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.

Abstract: An illuminator system for semiconductor chip testing has a rotary plate and a first light source and second light source mounted on the rotary plate. A controller is configured to rotate the rotary plate to provide a desired light output. A light output of the illuminator system is aligned to the desired first or second light source. A first semiconductor chip receives illumination from the desired source. The rotary plate is rotated until the desired light source is aligned to the light output. A quality or characteristic of light emitted by the first light source can be measured, and then the first light source can be adjusted, or an alert can be generated, if the quality or characteristic falls outside of a preconfigured range.

Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

Abstract: A compact tester including a housing having a base plate and a roof plate being parallel and defining a space therebetween. The compact tester includes one or more device-under-test press units having an actuator and a contact head movable by the actuator. The compact tester includes a reinforcement arrangement having a roof reinforcement sub-arrangement coupled to the roof plate and an upright reinforcement sub-arrangement coupled to the base plate. The upright reinforcement sub-arrangement includes a pair of reinforcing side walls extending upright from the base plate. The roof reinforcement sub-arrangement includes a reinforcing structure having a reinforcing panel portion attached flat against the roof plate and an elongated reinforcing rib portion protruding from the reinforcing panel portion and away from the roof plate.

Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.

Abstract: A measurement system of a device under test (DUT) includes a reference clock synthesizer configured to generate a master reference clock signal, a transmitter unit connected to the reference clock synthesizer and configured to connect to the DUT, and a measurement control system connected to the transmitter unit and configured to control the transmitter unit to generate a test signal pattern based on a first reference clock signal derived from the master reference clock signal, and generate a signal for passing through the DUT based on the test signal pattern. A receiver unit connected to the reference clock synthesizer is configured to connect to the DUT and to detect the signal and generate a digital signal based on the signal and a second reference clock signal derived from the master reference clock signal. The measurement control system is configured to provide an output signal based on the digital signal.

Abstract: A configurable electronic test system that is adapted for varying test processes and thermal conditions, consisting of a device handler working with multiple testers and a thermal environment module for controlling the thermal condition during test. The test system can be easily expanded by stacking more testers vertically for more test capacity without requiring an increase in floor space.