Abstract: A method of heat treating ceramic-based electronic components by providing a furnace fixture adapted to support the ceramic-based electronic components which is made from a substrate selected from the group consisting of silicon carbide (SiC), cordierite (2MgO.2Al2O.sub.3.5SiO.sub.2), mullite (3Al.sub.2 O.sub.3.2SiO.sub.2), stabilized zirconia, magnesium oxide (MgO) and alumina (Al.sub.2 O.sub.3) containing a glassy bond phase. A cladding layer of zirconia or magnesia is then deposited on the furnace fixture substrate by plasma deposition. The ceramic-based electronic component to be fired is placed on the zirconia-coated substrate; and heated to a desired temperature to heat treat the component.

Abstract: A method of heat treating ceramic-based electronic components by providing a furnace fixture adapted to support the ceramic-based electronic components which is made from a substrate selected from the group consisting of silicon carbide (SiC), cordierite (2MgO.2Al2O.sub.3.5SiO.sub.2), mullite (3Al.sub.2 O.sub.3.2SiO.sub.2), stabilized zirconia, and alumina (Al.sub.2 O.sub.3) containing a glassy bond phase. A cladding layer of zirconia is then deposited on the furnace fixture substrate by plasma deposition. The ceramic-based electronic component to be fired is placed on the zirconia-coated substrate; and heated to a desired temperature to heat treat the component.