Abstract: An electronic equipment cabinet is provided, which includes an enclosure defining an interior space. A support is disposed with the interior space and is configured to receive electronic equipment. The bottom portion defines a base plenum configured for at least one heat exchanger, which is in fluid communication with a low temperature fluid supply and a high temperature fluid return. A closed loop gas flow distribution pathway includes a first plenum communicating with the base plenum and configured to direct a low temperature gas to the support, and a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the base plenum. A temperature sensor is disposed with the enclosure to sense the temperature of the high temperature gas flow within the enclosure.

Abstract: An electronic equipment cabinet is provided, which includes an upper portion, a lower portion and a support configured to receive electronic equipment. The bottom portion defines a base plenum configured to receive a low temperature gas and communicates with a gas flow distribution pathway, which includes a first plenum communicating with the base plenum and configured to direct the low temperature gas to the support. The gas flow distribution pathway further includes a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the top portion. The top portion includes at least one fan configured to direct the high temperature gas flow from the gas flow distribution pathway. A temperature sensor senses the temperature of the high temperature gas flow and communicates with a control module to control the first plenum and the at least one fan for regulating temperature.