Patents Assigned to Afore Oy
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Patent number: 11226364Abstract: A testing device (100) is for electrically testing integrated circuits on a wafer (102). The testing device (100) includes a vacuum chamber (109), a chuck (101) for holding the wafer (102), a probe card (103) for electrically contacting the integrated circuits, and a radiation shield (107) arranged inside the vacuum chamber (109) and enclosing the chuck (101) and the probe card (103). In the testing device (100), the vacuum chamber (109) is provided with a gate valve (123), the radiation shield (107) is provided with a hatch (122), and the testing device (100) includes a wafer loading assembly (125) for loading the wafer (102) onto the chuck (101) through the gate valve (123) and the hatch (122).Type: GrantFiled: April 29, 2020Date of Patent: January 18, 2022Assignees: Afore Oy, Bluefors Cryogenics OyInventors: Aki Junes, Ari Kuukkala, Timo Salminen, Vesa Henttonen, Matti Manninen, David Gunnarsson, Leif Roschier
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Patent number: 11181574Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.Type: GrantFiled: April 29, 2020Date of Patent: November 23, 2021Assignees: Afore Oy, Bluefors Cryogenics OyInventors: Aki Junes, Ari Kuukkala, Timo Salminen, Vesa Henttonen, Matti Manninen, David Gunnarsson, Leif Roschier
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Publication number: 20200348356Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, and a radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card. In the testing device, the vacuum chamber is provided with a gate valve, the radiation shield is provided with a hatch, and the testing device comprises a wafer loading assembly for loading the wafer onto the chuck through the gate valve and the hatch.Type: ApplicationFiled: April 29, 2020Publication date: November 5, 2020Applicants: Afore Oy, BlueFors Cryogenics OyInventors: Aki JUNES, Ari KUUKKALA, Timo SALMINEN, Vesa HENTTONEN, Matti MANNINEN, David GUNNARSSON, Leif ROSCHIER
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Publication number: 20200348357Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.Type: ApplicationFiled: April 29, 2020Publication date: November 5, 2020Applicants: Afore Oy, BlueFors Cryogenics OyInventors: Aki Junes, Ari Kuukkala, Timo Salminen, Vesa Henttonen, Matti Manninen, David Gunnarsson, Leif Roschier
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Patent number: 7595653Abstract: A pressure testing apparatus for chips on a wafer has a pressure chamber, a support plate arranged between the upper and lower parts of the housing, a wafer chuck, a testing device and a positioning device. The wafer chuck, the testing device and the positioning device are supported to the support plate and arranged inside the pressure chamber. The support plate has, inside the pressure chamber, an opening providing a gas connection between the upper and lower parts of the housing.Type: GrantFiled: July 20, 2005Date of Patent: September 29, 2009Assignee: Afore OyInventors: Vesa Henttonen, Kari Hannukainen
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Publication number: 20070245808Abstract: A pressure testing apparatus for chips on a wafer has a pressure chamber, a support plate arranged between the upper and lower parts of the housing, a wafer chuck, a testing means and a positioning device. The wafer chuck, the testing means and the positioning device are supported to the support plate and arranged inside the pressure chamber. The support plate has, inside the pressure chamber, an opening providing a gas connection between the upper and lower parts of the housing.Type: ApplicationFiled: July 20, 2005Publication date: October 25, 2007Applicant: AFORE OYInventors: Vesa Henttonen, Kari Hannukainen