Patents Assigned to AG Communication Systems Corp.
  • Thermal management plate
    Patent number: 5019939
    Abstract: A thermal management plate designed to take advantage of the thermally conductive path provided as an integral part of printed circuit board component assemblies. The plate is a shelf-like unit providing both thermal management of electronic assemblies and a mounting arrangement for assemblies. Manufactured of high conductive material, the unit includes a printed circuit board assembly locator, a thermal path and a series of finned surfaces on the front and rear to dissipate heat generated by components.
    Type: Grant
    Filed: October 24, 1989
    Date of Patent: May 28, 1991
    Assignee: AG Communication Systems Corp.
    Inventor: William A. Reimer