Abstract: The invention pertains to a method and a device for die sinking and wire-cutting workpieces by means of electrical discharge machining. A machine frame (10) as well as a worktank (9) and a lower guide head (5) form a stationary unit referred to the main axis directions X, Y. The workpiece (2) is immersed in the worktank (9) and moved in the horizontal plane by means of the X/Y main axis drive (14). An upper guide head (4) also forms part of the stationary unit or can be moved by means of a Z drive (16) and/or a U/V drive (15). The lower guide head may also be designed such that it can be vertically moved by means of a lower Z drive (17). This concept is particularly suitable for producing microscopic components by means of electrical discharge machining and as a multielectrode machine that processes workpieces simultaneously or sequentially.