Patents Assigned to Agilent Technologies
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Patent number: 6271740Abstract: A reed relay with which offset current is prevented competently, even when a coil is excited for relay operation, and high-speed, high-accuracy measurement of very low signals is possible, and energy consumption and production costs during assembly are low. The reed relay comprises a reed switch, an electrostatic shielded pipe through which the reed switch passes, an insulating support members and that support the reed switch inside the electrostatic shielded pipe, a coil bobbin that has a tube for insertion of electrostatic shielded pipe, and a coil wound and installed around the bobbin.Type: GrantFiled: June 28, 2000Date of Patent: August 7, 2001Assignee: Agilent Technologies, Inc.Inventor: Kiyoshi Chikamatsu
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Patent number: 6272385Abstract: This invention relates generally to medical electrode systems and, in particular, to an independently deployable sealed defibrillator electrode for use with an automatic or semi-automatic external defibrillator (AED). The invention also relates to the method of use thereof. More specifically, this invention relates to an electrode system comprising an electrode layer and a releasing layer which are hermetically sealed together. Each layer contains a pull-tab or gripper for allowing the user to deploy the electrode in one step by pulling apart the two layers. This invention is also directed to a method of using an electrode system of the invention wherein the electrode is deployed in one step by pulling the electrode layer and the releasing layer apart.Type: GrantFiled: September 1, 1998Date of Patent: August 7, 2001Assignee: Agilent Technologies, Inc.Inventors: Jon M. Bishay, Christine Janae
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Patent number: 6271673Abstract: A probe for measuring signals with a narrow contact pitch comprises an end section having a main tip member and a sub-tip member, each of which passes through one of two holes in a housing. The sub-tip member is electrically connected to the housing and the main-tip member is insulated from the housing by an insulation member. The sub-tip member is pivotally connected to the housing. The subtip member is asymmetric with respect to the pivot and therefore, its sharpened end can trace a circular orbit when the sub-tip member turns on its pivot. The distance between the two end sections of these tip members (that is, the contact pitch) can be set to a desired length by positioning sub-tip sharpened end section to any point on this orbit.Type: GrantFiled: March 27, 1999Date of Patent: August 7, 2001Assignee: Agilent Technologies, Inc.Inventors: Masaji Furuta, Koichi Yanagawa
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Patent number: 6269267Abstract: An electrotherapy device includes a power supply and electrodes. The electrodes are coupled to the power supply to deliver a defibrillating shock to a patient. Electronic circuitry is coupled to the electrodes and is operable to detect heart rhythms via the electrodes. Further, control circuitry is coupled to the electronic circuitry and the power supply and configurable to selectively classify patient heart rhythms that generate a shockable condition, the control circuitry operable to arm the power supply for energizing the electrodes responsive to such detectable shockable condition. A method is also provided.Type: GrantFiled: April 12, 2000Date of Patent: July 31, 2001Assignee: Agilent Technologies, Inc.Inventors: Gust H. Bardy, Thomas D. Lyster
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Patent number: 6268656Abstract: Uniform height solder bumps are created on a semiconductor wafer by exposing a dummy pattern of under bump metal for solder plating. The dummy pattern of exposed under bump metal follows the outer edge outline of a pattern of die that exists on the semiconductor wafer. The dummy pattern of under bump metal is exposed by removing a portion of a layer of photoresist that is deposited over the under bump metal. The dummy pattern of under bump metal is exposed on the wafer at the same time that under bump metal above the contact pads is exposed. Solder material is then plated onto the exposed under bump metal that exists above the contact pads and in the dummy pattern. The dummy pattern of exposed under bump metal around the outer edge of the die pattern causes current crowding to occur primarily at the dummy pattern of exposed under bump metal instead of at the contact pads that are on die at the outer edge of the die pattern.Type: GrantFiled: August 15, 2000Date of Patent: July 31, 2001Assignee: Agilent Technologies, Inc.Inventors: Jacques Leibovitz, Susan Swindlehurst
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Patent number: 6268750Abstract: A method and circuit for flattening the output resistance response on a signal pad of an integrated circuit is presented. Impedance matching is accomplished using pull-up and pull-down FET arrays. Various combinations of pull-up PFETs in the pull-up FET array are programmably enabled by a pull-up calibration word when driving the output pad high. Various combinations of pull-down NFETs in the pull-down FET array are programmably enabled by a pull-down calibration word when driving the output pad low. An NFET in the pull-up FET calibration array and a PFET in the pull-down FET array respectively allow the output driver to supply more current during the initial stages of a voltage transition, resulting in a flatter overall output resistance Ro response.Type: GrantFiled: January 11, 2000Date of Patent: July 31, 2001Assignee: Agilent Technologies, Inc.Inventor: Gerald L Esch, Jr.
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Patent number: 6264892Abstract: Miniaturized planar column devices for use in a liquid phase separation apparatus are described. The devices include microstructures that have been fabricated by laser ablation in a variety of novel support substrates. Devices formed according to the methods of the invention include associated laser-ablated features required for function, such as on-device reservoirs or makeup flow compartments, analyte detection means and sample injection means. The miniaturized columns can be used in an apparatus intended for analysis of either small and/or macromolecular solutes in the liquid phase which employs chromatographic, electrophoretic or electrochromatographic separation means. The apparatus can include a variety of optional injection means, manifolds, keeper means, post column collection means, and combinations thereof.Type: GrantFiled: January 11, 2000Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventors: Patrick Kaltenbach, Sally A. Swedberg, Klaus E. Witt, Fritz Bek, Laurie S. Mittelstadt
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Patent number: 6266561Abstract: An electrotherapy apparatus, such as a defibrillator, includes a connecting mechanism coupled between an energy source and electrodes. The connecting mechanism allows selective coupling of the energy source to the electrodes. The energy source includes a capacitor and a high voltage power supply for charging the capacitor. The electrotherapy apparatus further includes a waveform measuring device for measuring a patient ECG waveform. The electrotherapy apparatus also includes a controller coupled to the connecting mechanism, the energy source, and the waveform measuring device. The controller actuates the connecting mechanism to deliver a bi-phasic waveform to the patient. In addition, the controller analyzes the ECG waveform to detect when the patient is experiencing either course arrhythmia or fine arrhythmia.Type: GrantFiled: April 1, 1999Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventor: Bradford E Gliner
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Patent number: 6265246Abstract: A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist, semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads and a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads and form a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.Type: GrantFiled: July 23, 1999Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventors: Richard C. Ruby, Tracy E. Bell, Frank S. Geefay, Yogesh M. Desai
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Patent number: 6264613Abstract: Disclosed is a medical device for introduction into a patient's body, in particular into the patient's blood vessel, for measuring a physiological parameter. The medical device comprises means for coding the site of an application of the medical device in the patient's body and/or means for coding the effect of the site of an application of the medical device in the patient's body on the measurement of the physiological parameter.Type: GrantFiled: September 23, 1999Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventors: Urich J. Pfeiffer, Ernst-Peter Salfeld
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Patent number: 6265717Abstract: An apparatus and a method for inductively coupled plasma mass spectrometry (ICP-MS) with improved detection limits are disclosed. The ICP-MS includes apparatus for generating an inductively coupled plasma (ICP) in a gas at substantially atmospheric pressure to ionize a sample, a mass analyzer (MS) operable at a low pressure of the order of 10−2-10−4 Pa for detecting at least part of the sample ions, and an interface for transferring the sample ions from the ICP to the MS. The interface is provided with a controller for increasing the pressure in the interface from its normal pressure, for example, to 350-450 Pa. The increased pressure may reduce the sensitivity of the instrument, but can improve detection limits by selective reduction of interfering ions.Type: GrantFiled: December 8, 1998Date of Patent: July 24, 2001Assignee: Agilent TechnologiesInventors: Kenichi Sakata, Noriyuki Yamada, Ryotaro Midorikawa, James Charles Wirfel, Donald Lee Potter, Abelardo Gabriel Gutierre Martinez
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Patent number: 6265325Abstract: A method for fabricating dual gate dielectric layers on a semiconductor substrate involves utilizing a single photolithographic step to form layer stacks having two different gate dielectric layers and associated polysilicon layers, and then utilizing a physical planarization process to remove excess polysilicon and silicon oxide. According to the method, a first gate dielectric is formed on the first and second device areas of a substrate. A first polysilicon layer is deposited onto the first gate dielectric, and portions of the first polysilicon layer are removed utilizing a photolithographic process. The first gate dielectric is removed over the second device area, and a second, thinner gate dielectric is formed over the second device area. A second polysilicon layer is formed over the second gate dielectric and over the first polysilicon layer.Type: GrantFiled: April 26, 1999Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventors: Min Cao, Dietrich W Vook
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Patent number: 6266787Abstract: A system that can test individual components having tolerances on a circuit board without complete access to every node on the board is disclosed. The system uses a method that develops test limits from a model of the board, component tolerances, and a list of accessible nodes. A method of reducing the complexity of the test problem by limiting the number of components under consideration is also disclosed. A method of reducing the complexity of the test problem by limiting the number of nodes under consideration is also disclosed. A method of picking nodes to apply stimulus to a board is also disclosed. Finally, a method of correcting for certain parasitics associated with tester hardware is disclosed.Type: GrantFiled: October 9, 1998Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventors: John E. McDermid, Cherif Ahrikencheikh, Rodney A. Browen, William P. Darbie, Kay C. Lannen
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Patent number: 6266562Abstract: A defibrillator is provided with a test load feature which is automatically inserted into electrode paddle jacks when a defibrillator housing lid is closed, placing the defibrillator controller into a TEST MODE. Closing the lid permits actual firing of a shock pulse through the electrode connector through the test load, opening the lid automatically disconnects the test load and permits insertion of electrode paddles, placing the defibrillator into a PATIENT-READY MODE.Type: GrantFiled: April 30, 1999Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventor: Kent W. Leyde
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Patent number: 6266000Abstract: A light emitting diode (LED) driver pad comprising a multiplying digital to analog converter (MDAC), which allows for differing LED characteristics to be matched digitally. Either a plurality of MDACs are integrated onto a single integrated circuit, one MDAC per color of LED, or a single MDAC may be multiplexed to drive a plurality of different color LEDs. The MDAC allows for LED operating current to be set digitally, while allowing an overall brightness or intensity control, thus achieving uniform color balance over a range of operating characteristics.Type: GrantFiled: April 30, 1999Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventors: Gani Jusuf, Colm P. Lysaght, Ryan P. Donohue
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Publication number: 20010008287Abstract: The invention concerns a photodetector for detecting electromagnetic waves, especially in the UV range, and a method of forming it. The photodetector has at least one substrate layer consisting essentially of silicon. The substrate layer has a surface that is (1) at least partially covered with a cover layer transparent to electromagnetic waves and (2) covered by a cover layer surface. The cover layer has an essentially saw-tooth, trapezoidal and/or V-shaped in a cross-sectional cut through the substrate layer and the cover layer thickness is inhomogeneous.Type: ApplicationFiled: January 12, 2001Publication date: July 19, 2001Applicant: AGILENT TECHNOLOGIES, INC.Inventors: Karsten Kraiczek, Hubert Kuderer
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Publication number: 20010008613Abstract: A modular microchannel apparatus for analysis of an analyte. The apparatus includes a separation unit and a reservoir unit. The separation unit has a microchannel. The analyte can be driven to pass through the microchannel such that the time for the analyte to pass through the microchannel is indicative of the molecular characteristics of the analyte. The reservoir unit has one or more reservoirs for coupling operatively modularly with the separation unit to supply liquid reagents to the separation unit. The reservoirs has prepackaged liquid reagents in it before the reservoir unit is coupled with the separation unit.Type: ApplicationFiled: September 17, 1998Publication date: July 19, 2001Applicant: AGILENT TECHNOLOGIESInventors: PATRICK KALTENBACH, TOM A. VAN DE GOOR
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Patent number: 6262602Abstract: A comparator detects rising transitions of an input waveform and another comparator detects falling transitions. Each comparator detects their respective transition with a different threshold voltage. The outputs of these comparators are multiplexed into the clock input of a flip-flop. The flip-flop's inverted output is connected through a time delay to the input of the flip-flop to form a toggling configuration. The output of the time delay is also connected to the select input of a multiplexer that controls the multiplexer to multiplex the outputs of the two comparators into the clock input of the flip-flop. The threshold voltages chosen for the two comparators are chosen to be in the center of the incident edges of the distorted signal of a source-terminated transmission line. The time delay is chosen to be longer than the difference between the arrival of the incident wave and the arrival of the first reflected wave.Type: GrantFiled: March 18, 1999Date of Patent: July 17, 2001Assignee: Agilent Technologies, Inc.Inventor: Steven D. Draving
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Patent number: 6261523Abstract: An adjustable-volume, sealed chemical-solution-confinement vessel for enclosing the inner bottom surface of the chemical-solution-confinement vessel within a sealed chamber. The chemical-solution-confinement vessel comprises a well-shaped base into which a complementarily-shaped lid is inserted. The lid can be inserted to a first position, in order to create a small volume sealed chamber above the inner bottom surface of the chemical-solution-confinement vessel, and can be retracted to a second position in order to create a larger volume sealed chamber above the inner bottom surface of the chemical-solution-confinement vessel. The lid may contain a port or aperture for introducing a fluid or material into the sealed chamber.Type: GrantFiled: April 27, 1999Date of Patent: July 17, 2001Assignee: Agilent Technologies Inc.Inventor: Carol T. Schembri
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Patent number: D445509Type: GrantFiled: February 17, 2000Date of Patent: July 24, 2001Assignee: Agilent Technologies, Inc.Inventors: Manfred Berndt, Raoul Dinter, Mark Goellner