Patents Assigned to Agllent Technologies, Inc.
  • Electronic or opto-electronic packages
    Publication number: 20030086243
    Abstract: An electronic device such as a laser diode is mounted on a heatsink assembly within a TO-can package. The heatsink assembly is mounted in heat exchange relation with a heat pipe by being on or adjacent a heat pipe. The heat pipe is either attached to an exterior face of the TO-can package or passes into the TO-can package to efficiently draw heat away from the heatsink assembly.
    Type: Application
    Filed: November 6, 2002
    Publication date: May 8, 2003
    Applicant: Agllent Technologies, Inc.
    Inventor: Ryan Kingsley Harding