Patents Assigned to AGY Holding Corp.
  • Patent number: 9783454
    Abstract: Glass compositions and high-modulus, and high-strength glass fibers made therefrom, being capable of economical, continuous processing and suitable for the production of high-strength and/or high stiffness, low-weight composites, such as windturbine blades, the glass composition comprises the following constituents in the limits defined below, expressed as weight percentages: between about 56 to about 61 weight percent SiO2; between about 16 to about 23 weight percent Al2O3, wherein the weight percent ratio of SiO2/Al2O3 is between about 2 to about 4; between about 8 to about 12 weight percent MgO; between about 6 to about 10 weight percent CaO, wherein the weight percent ratio of MgO/CaO is between about 0.7 to about 1.5; between about 0 to about 2 weight percent Na2O; less than about 1 weight percent Li2O; and total residual transition metal oxides of less than about 2 weight percent.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: October 10, 2017
    Assignee: AGY Holding Corp.
    Inventors: Robert L. Hausrath, Anthony V. Longobardo
  • Patent number: 8728964
    Abstract: The present disclosure relates to a glass composition having a low thermal expansion coefficient, specifically, a glass composition comprising about 55 to less than 64 weight percent of silicon oxide, about 15 to about 30 weight percent of aluminum oxide, about 5 to about 15 weight percent of magnesium oxide, about 3 to about 10 weight percent boron oxide, about 0 to about 11 weight percent calcium oxide, and about 0 to about 2 weight percent of alkali oxide, the remainder being trace compounds of less than about 1 weight percent, is provided. Glass fibers and composite articles formed therefrom are also provided.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: May 20, 2014
    Assignee: AGY Holding Corp.
    Inventors: Sudhendra V. Hublikar, Robert L. Hausrath, Anthony V. Longobardo
  • Publication number: 20120058698
    Abstract: Embodiments of the present invention relate to sizing compositions, glass fibers, and fabrics. For example, some embodiments provide a composition that includes: (a) a cooked starch comprising fluid-swollen starch particles and (b) a film forming polymer. The film forming polymer, in some embodiments, has a glass transition temperature from about ?50° C. to about 150° C. The fluid-swollen starch particles, in some embodiments, exhibit a granular swelling power (GSP) from about 1 to about 20.
    Type: Application
    Filed: August 19, 2011
    Publication date: March 8, 2012
    Applicant: AGY HOLDING CORP.
    Inventors: Tingdong Lin, Donald Bruce Ogilvie, Sudhendra Venkatesh Hublikar
  • Publication number: 20110042129
    Abstract: A glass fiber having a low dielectric constant and low dielectric loss tangent consists essentially of by weight, as a glass composition, 52 to 60% of SiO2, 11 to 16% of Al2O3, 20 to 30% of B2O3, and 4 to 8% of CaO, and substantially no MgO, substantially no Li2O, substantially no Na2O, substantially no K2O, and substantially no Ti2O. The glass fiber also may contain up to 2% F2 by weight. The glass fiber is ideal for use as reinforcement for printed wiring boards, and has excellent dielectric properties at frequencies of about 18 GHz or higher.
    Type: Application
    Filed: October 26, 2007
    Publication date: February 24, 2011
    Applicant: AGY HOLDING CORP.
    Inventors: Douglas S. Boessneck, J. Ronald Gonterman, Oleg A. Prokhorenko
  • Patent number: 7678721
    Abstract: A glass fiber having a low dielectric constant and low dielectric loss tangent consists essentially of by weight, as a glass composition, 52 to 60% of SiO2, 11 to 16% of Al2O3, 20 to 30% of B2O3, and 4 to 8% of CaO, and substantially no MgO, substantially no Li2O, substantially no Na2O, substantially no K2O, and substantially no Ti2O. The glass fiber also may contain up to 2% F2 by weight. The glass fiber is ideal for use as reinforcement for printed wiring boards, and has excellent dielectric properties at frequencies of about 18 GHz or higher.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: March 16, 2010
    Assignee: AGY Holding Corp.
    Inventors: Douglas S. Boessneck, J. Ronald Gonterman, Oleg A. Prokhorenko