Abstract: A radio transceiver module includes an interposer, a first wire routing layer, a second wire routing layer, a passive component and a wireless network chip. The interposer is provided with a first surface and an opposite second surface, and includes a plurality of through-holes. The first wire routing layer is configured on the first surface of the interposer, the second wire routing layer is configured on the second surface of the interposer, the passive component and the wireless network chip are configured on a surface of the first wire routing layer; whereas, the wireless network chip, the interposer and the passive component are electrically connected with one another.

Abstract: A system in package (SIP) batch test method and an SIP batch test system are applicable to an unpartitioned circuit module having a plurality of devices under test (DUTs). The circuit module is loaded in a loading module of the batch test system after probing test and molding operations. A test module of the batch test system is electrically coupled to at least two DUTs. At least two testers provide two different signal tests. A signal transmission controller controls signal transmission paths between the testers and the test module. A test controller controls the two testers and the test module to test the electrically coupled DUTs in parallel and record test results of the DUTs in configuration data. Finally, the circuit module is partitioned, so as to classify the DUTs according to the test results.

Abstract: A wireless transceiver module has a plurality of through holes and includes a wireless network chip, a circuit substrate, a Bluetooth chip, and a plurality of conductive connection structures. The Bluetooth chip is disposed between the circuit substrate and the wireless network chip, and the through holes are formed by passing through the wireless network chip, the circuit substrate, and the Bluetooth chip. The conductive connection structures are respectively disposed in the through hole. With the conductive connection structures, the Bluetooth chip, the wireless network chip, and the circuit substrate are electrically connected with each another.