Patents Assigned to AICP TECHNOLOGY CORPORATION
  • Patent number: 11538816
    Abstract: An integral multifunction chip is provided. The integral multifunction chip includes an electronic fuse and an interface fuse. The interface fuse and the electronic fuse are disposed in parallel and integrated in a single chip. In a case where only a single chip is provided, the integral multifunction chip of the present disclosure can be selectively operated in a working mode of the electronic fuse or the interface fuse, so that convenience of use of the integral multifunction chip can be improved.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: December 27, 2022
    Assignee: AICP TECHNOLOGY CORPORATION
    Inventor: Kei-Kang Hung
  • Patent number: 11467567
    Abstract: A method and a system for developing semiconductor device fabrication processes are provided. The developments of vertical and lateral semiconductor device fabrication processes can be integrated in the system. First, according to a target semiconductor device and a specification thereof, an initial target model and a general database are captured. The initial target model and the general database are compared to obtain a corresponding relationship. According to the corresponding relationship, multiple fixed fabrication parameters of the general database are applied to the initial target model, such that at least one adjustable parameter is defined. Thereafter, the parameter is set according to a setting instruction received through a user interface to produce a target model to be simulated. A simulation test is performed with the target model, and the adjustable parameter is modified until the simulation result of the target model satisfies a standard result.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: October 11, 2022
    Assignee: AICP TECHNOLOGY CORPORATION
    Inventor: Kei-Kang Hung
  • Patent number: 11257828
    Abstract: An integral multifunction chip is provided. The integral multifunction chip includes an electronic fuse and an interface fuse. The interface fuse and the electronic fuse are disposed in parallel and integrated in a single chip. In a case where only a single chip is provided, the integral multifunction chip of the present disclosure can be selectively operated in a working mode of the electronic fuse or the interface fuse, so that convenience of use of the integral multifunction chip can be improved.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: February 22, 2022
    Assignee: AICP TECHNOLOGY CORPORATION
    Inventor: Kei-Kang Hung