Patents Assigned to AIM Metals & Alloys Inc.
  • Lead-free high reliability solder alloys
    Patent number: 10195698
    Abstract: A lead-free, tin-based solder alloy contains about 0.6 to about 0.8 wt % copper, about 2.8 to about 3.2 wt % silver, about 2.8 to about 3.2 wt % bismuth, about 0.5 to about 0.7 wt % antimony, about 0.04 to about 0.07 wt % nickel, and about 0.007 to about 0.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: February 5, 2019
    Assignee: AIM Metals & Alloys Inc.
    Inventors: Mehran Maalekian, Karl Seelig
  • LEAD-FREE HIGH RELIABILITY SOLDER ALLOYS
    Publication number: 20170066089
    Abstract: A lead-free, tin-based solder alloy contains about 0.6 to about 0.8 wt % copper, about 2.8 to about 3.2 wt % silver, about 2.8 to about 3.2 wt % bismuth, about 0.5 to about 0.7 wt % antimony, about 0.04 to about 0.07 wt % nickel, and about 0.007 to about 0.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 9, 2017
    Applicant: AIM Metals & Alloys Inc.
    Inventors: Mehran Maalekian, Karl Seelig