Patents Assigned to AIMM, LLC
  • Publication number: 20240033709
    Abstract: In one aspect, an oxygenated hierarchically porous carbon (an “O-HPC”) is provided, the O-HPC comprising: a hierarchically porous carbon (an “UPC”), the HPC comprising a surface, the surface comprising: (A) first order pores having an average diameter of between about 1 ?m and about 10 ?m; and (B) walls separating the first order pores, the walls comprising: (1) second order pores having a peak diameter between about 7 nm and about 130 nm; and (2) third order pores having an average diameter of less than about 4 nm, wherein at least a portion of the HPC surface has been subjected to O2 plasma to oxygenate and induce a negative charge to the surface. In one aspect, the O-HPC further comprises metal nanoparticles dispersed within the first, second, and third order pores. Methods for making and using the metal nanoparticle-impregnated O-HPCs are also provided.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 1, 2024
    Applicants: AIMM, LLC, The University of Dayton
    Inventors: Luis Estevez, Kenya Crosson
  • Publication number: 20230249153
    Abstract: In one aspect, an oxygenated hierarchically porous carbon (an “O-HPC”) is provided, the O-HPC comprising: a hierarchically porous carbon (an “HPC”), the HPC comprising a surface, the surface comprising: (A) first order pores having an average diameter of between about 1 ?m and about 10 ?m; and (B) walls separating the first order pores, the walls comprising: (1) second order pores having a peak diameter between about 7 nm and about 130 nm; and (2) third order pores having an average diameter of less than about 4 nm, wherein at least a portion of the HPC surface has been subjected to O2 plasma to oxygenate and induce a negative charge to the surface. In one aspect, the O-HPC further comprises metal nanoparticles dispersed within the first, second, and third order pores. Methods for making and using the metal nanoparticle-impregnated O-HPCs are also provided.
    Type: Application
    Filed: October 26, 2021
    Publication date: August 10, 2023
    Applicants: AIMM, LLC, The University of Dayton
    Inventors: Luis Estevez, Kenya Crosson