Abstract: The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate, which is made of an aluminum plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.
Type:
Grant
Filed:
August 7, 2008
Date of Patent:
August 20, 2013
Assignee:
Ain Co., Ltd.
Inventors:
Koji Takeuchi, Masami Matsuda, Kaoru Ono, Makoto Hosoda
Abstract: The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing board, including coating a surface of a metal substrate, which is made of an aluminium plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.
Type:
Application
Filed:
August 7, 2008
Publication date:
December 1, 2011
Applicant:
AIN CO., LTD.
Inventors:
Koji Takeuchi, Masami Matsuda, Kaoru Ono, Makoto Hosoda