Patents Assigned to AIP, Inc.
  • Publication number: 20250035852
    Abstract: An optical coupling structure, adapted for a photonic integrated circuit, includes a waveguide device and an optical fiber assembly. The waveguide device includes a waveguide substrate including a plurality of optical waveguide paths extending between a first guide surface and a second guide surface of the waveguide substrate. The first guide surface defines a first light exit area at which ends of the optical waveguide paths are exposed, the second guide surface defines a second light exit area at which the other ends of the optical waveguide paths are exposed. The second light exit area has an entire length less than at least one-half of an entire length of the first light exit area. The optical fiber assembly is connected to the first guide surface of the waveguide device.
    Type: Application
    Filed: July 23, 2024
    Publication date: January 30, 2025
    Applicant: AIP Inc.
    Inventor: Chia Lee
  • Publication number: 20250035870
    Abstract: An optical coupling structure for an optoelectronic integrated circuit includes a first connector and an optical fiber device. The first connector is disposed on the optoelectronic integrated circuit and includes a base including a lower surface and a front end, and a waveguide device assembled in the base and including a first surface, a first guide surface adjoining the first surface and located at the front end, and a plurality of optical waveguide paths extend to the first guide surface. The optical fiber device includes a second connector including a connecting surface and detachably connected to the first connector such that the connecting surface and the first guide surface directly face each other.
    Type: Application
    Filed: November 16, 2023
    Publication date: January 30, 2025
    Applicant: AIP Inc.
    Inventor: Chia Lee
  • Publication number: 20250035867
    Abstract: A sealing structure for an optoelectronic transceiver device includes a first casing, a second casing, and a sealing element. The optoelectronic transceiver device is arranged between the first casing and the second casing. At least a notch portion is arranged between peripheral portions of the first casing and the second casing. The sealing element includes at least a retaining block positioned in the notch portion and encompassing a part of an optical fiber assembly, which is included in the optoelectronic transceiver device and extends out of the notch portion.
    Type: Application
    Filed: March 5, 2024
    Publication date: January 30, 2025
    Applicant: AIP Inc.
    Inventor: Chia Lee
  • Publication number: 20250035866
    Abstract: An optical coupling structure, adapted for an optoelectronic device, includes a light source device including a fixed board, a bar substrate positioned on the fixed board, and a light unit positioned on the bar substrate. The light unit includes a functional portion and a light-emitting portion that are divided into a plurality of light emitters, and the bar substrate is configured to cross a bottom of each of the light emitters. A waveguide device is disposed adjacent to a mating surface included in the fixed board and the light emitters of the light source and enables light signal transmission from the light emitters. An optical fiber assembly connected to the waveguide device.
    Type: Application
    Filed: July 23, 2024
    Publication date: January 30, 2025
    Applicant: AIP Inc.
    Inventor: Chia Lee
  • Publication number: 20250040082
    Abstract: A sealing structure for an immersion cooling apparatus housing and cooling an optoelectronic processing device includes a first lid portion, a second lid portion detachably connected to the first lid portion, and a sealing component. The sealing component includes a first sealing part disposed on the first lid portion and a second sealing part disposed on the second lid portion. The first lid portion, the second lid portion, and the sealing component jointly define a sealing lid hermetically covering an opening portion of a tank body included in the immersion cooling apparatus. Part of optical fibers included in the optoelectronic processing device are sandwiched between and encompassed by the first sealing part and the second sealing part.
    Type: Application
    Filed: June 5, 2024
    Publication date: January 30, 2025
    Applicant: AIP Inc.
    Inventor: Lee Chia
  • Patent number: 6324768
    Abstract: A ball lock punch retainer system, including a punch, with a ball receiving grooved seat therein, a punch retainer body, a backing plate, a spring hole located in the retainer body, a ball positioned within said spring hole, a spring located in said spring hole, said spring generally acting to bias said ball into a locking engagement with said punch, an access hole located in the retainer body and communicating with the ball located in the spring hole, an elongated gage member which can be moved into and out of said access hole, one end of said gage member having a ball contact surface thereon, said gage member having a indicating area thereon with an upper end, a middle part, and a lower end, and the gage member being operative to determine when the ball lock is in proper position.
    Type: Grant
    Filed: April 18, 2000
    Date of Patent: December 4, 2001
    Assignee: AIP, Inc.
    Inventor: Charles G. Wellman
  • Patent number: 5881625
    Abstract: An automatic change-over ball lock punch retainer including a punch retainer having a punch, a retainer block, and an arm member in a sliding engagement retainer with the retainer housing block. The arm member having a camming means which interengages with an inclined surface of the punch retainer to move a punch into an active or inactive punch position.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: March 16, 1999
    Assignee: AIP Inc.
    Inventor: Charles G. Wellman
  • Patent number: 5284069
    Abstract: An improved punch retainer is disclosed in which a backing plate extends over a relatively large surface area to dissipate force from a punch. A punch retainer body and the tacking plate are permanently connected to each other and include passages which are finally ground after the two have been permanently connected. With this arrangement, it is ensured that passages within the backing plate and retainer body are all properly aligned during formation of the punch retainer. Since the backing plate dissipates force over a relatively large surface area, the punch retainer may be used in heavier applications than prior art punch retainers. A spring passage may be closed off by a seal received in the backing plate, allowing the use of standard springs. In a method according to the present invention, a dowel passage in the backing plate is finally ground such that it is centered on the center line of the punch within the retainer.
    Type: Grant
    Filed: December 15, 1992
    Date of Patent: February 8, 1994
    Assignee: AIP inc.
    Inventor: Charles G. Wellman
  • Patent number: 5181438
    Abstract: An improved punch retainer is disclosed in which a backing plate extends over a relatively large surface area to dissipate force from a punch. A punch retainer body and the backing plate are permanently connected to each other and include passages which are finally ground after the two have been permanently connected. With this arrangement, it is ensured that passages within the backing plate and retainer body are all properly aligned during formation of the punch retainer. Since the backing plate dissipates force over a relatively large surface area, the punch retainer may be used in heavier applications than prior art punch retainers. A spring passage may be closed off by a seal received in the backing plate, allowing the use of standard springs. In a method according to the present invention, a dowel passage in the backing plate is finally ground such that it is centered on the center line of the punch within the retainer.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: January 26, 1993
    Assignee: AIP inc.
    Inventor: Charles G. Wellman
  • Patent number: 5038599
    Abstract: An improved punch retainer is disclosed in which a backing plate extends over a relatively large surface area to dissipate force from a punch. A punch retainer body and the backing plate are permanently connected to each other and include passages which are finally ground after the two have been permanently connected. With this arrangement, it is ensured that passages within the backing plate and retainer body are all properly aligned during formation of the punch retainer. Since the backing plate dissipates force over a relatively large surface area, the punch retainer may be used in heavier applications than prior art punch retainers. A spring passage is closed off by a seal received in the backing plate, allowing the use of standard springs.
    Type: Grant
    Filed: April 10, 1990
    Date of Patent: August 13, 1991
    Assignee: AIP Inc.
    Inventor: Charles G. Wellman