Patents Assigned to AIP Networks, Inc.
  • Patent number: 6543087
    Abstract: The micro-electromechanical hinged flap system includes a substantially horizontal substrate and a main flap hinged on one side thereof to the substrate. The system also includes at least one locking flap, preferably two, for securing the main flap in a substantially vertical position. The locking flap is coupled to the substrate by means of a biasing mechanism that continually forces the locking flap toward a position parallel to the substrate. Also provided is a method for assembling a micro-electromechanical hinged flap system. A locking flap is rotated through an acute angle against a biasing force. The biasing force is caused by a biasing mechanism coupling the locking flap to a substrate. A main flap is then raised, whereafter the locking flap is released, such that the biasing force causes the locking flap to engage with the main flap, thereby, securing the main flap in position at the predetermined angle.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: April 8, 2003
    Assignee: AIP Networks, Inc.
    Inventors: J. Andrew Yeh, Tom A. Kwa, Robertus Petrus Van Kampen