Patents Assigned to AJS Automation, Inc.
  • Apparatus and methods for handling semiconductor wafers
    Patent number: 6578893
    Abstract: Disclosed are apparatus and methods used for handling semiconductor wafers or similar articles. In particular, the apparatus disclosed is capable of flexibly gripping items of various shapes and sizes in a manner that substantially reduces or eliminates the likelihood of damage thereto. The apparatus is particularly suited to being used as a robotic end effector for handling wafers using edge-gripping techniques.
    Type: Grant
    Filed: October 1, 2001
    Date of Patent: June 17, 2003
    Assignee: AJS Automation, Inc.
    Inventors: Alan J. Soucy, James S. Castantini