Abstract: This invention enables a bandwidth efficient computer simulation of sustained contact between objects. When an object comes into sustained contact with a second object, it will communicate to the second object a transfer function describing the contact, and vice-versa. The transfer function enables the objects to simulate the sustained contact for as long as the contact continues, eliminating any need for further network communication between the objects regarding the state of the contact until the contact terminates.

Abstract: A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.

Abstract: A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.

Abstract: A semiconductor package includes a lead frame with a die or chip mounted on a die pad, a base made of a thermoplastic material and having a cavity, and a lid made of thermoplastic material ultrasonically welded to the base to cover the cavity and protect the electronic device in the package. The package may include a substrate with conductive traces.A method of attaching a lid to a semiconductor package base includes the steps of providing a semiconductor package base having an open cavity, providing a thermoplastic lid that covers the open cavity, placing the lid on the semiconductor package base so that the lid covers the open cavity, applying pressure to hold the lid and body together, and attaching the lid to the base by ultrasonically welding them together.

Abstract: A semiconductor package includes a lead frame with a die or chip mounted on a die pad, a base made of a thermoplastic material and having a cavity, and a lid made of thermoplastic material ultrasonically welded to the base to cover the cavity and protect the electronic device in the package. The package may include a substrate with conductive traces. A method of attaching a lid to a semiconductor package base includes the steps of providing a semiconductor package base having an open cavity, providing a thermoplastic lid that covers the open cavity, placing the lid on the semiconductor package base so that the lid covers the open cavity, applying pressure to hold the lid and body together, and attaching the lid to the base by ultrasoncially welding them together.

Abstract: Lead frame workholder and transport apparatus for holding and transporting a strip of lead frames from one station to another, each lead frame having a pad and a locating pinhole, comprises a track having an input station at one end and an output station at the other end with an application station in between, a vacuum loader for loading a strip of lead frames onto the input station, a first transporter for contacting the lead frame strip in the input station by inserting a pin into the locating pinhole and moving the strip along the track to the application station, and a second transporter for moving the strip to the output station and into an exit carrier. A method of applying an epoxy layer to the pads of a strip of lead frames using the apparatus is disclosed.