Abstract: A megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate is provided. The apparatus includes a megasonic probe, a transducer configured to energize the probe, and a heat transfer element disposed between the transducer and the probe. The heat transfer element may be configured to direct the sonic energy from the transducer toward specific areas of the probe so as to reduce the effect of normal-incident waves relative to shallow-angle waves. Alternatively, a rear end face of the probe may be configured for this purpose. Another embodiment provides a coupler disposed between the heat transfer element and the rear end face of the probe for directing the sonic energy from the transducer toward specific areas of the probe.

Abstract: A transducer assembly for the megasonic processing of an article and apparatus incorporating the same. The transducer assembly comprises a vibration transmitter having a portion configured to be positioned adjacent to and spaced from the surface of an article so that when fluid is applied to the surface of the article, a meniscus of the fluid forms between the surface of the article and the portion of the vibration transmitter. The transducer assembly also comprises a transducer coupled to the vibration transmitter, where the transducer can oscillate to propagate megasonic energy through the vibration transmitter and through the meniscus of the fluid. In one embodiment, the transducer is located within an enclosed space and at least one passageway is provided for flowing a gas in and/or out of the enclosed space. In an another embodiment, the portion of the vibration transmitter includes an elongated edge that is positioned close to and generally parallel to a surface of the article.

Abstract: A transducer assembly used for the megasonic processing of an article. In one aspect, the transducer assembly comprises: a vibration transmitter having a rear portion adapted to be supported adjacent to an article to be processed and having an elongated forward portion adapted to extend close to a surface of the article so that when a fluid is applied to the surface of the article, a meniscus of the fluid is formed between the elongated forward portion and the surface of the article; and a transducer coupled to the rear portion of the transmitter, the transducer adapted to oscillate at a frequency for propagating megasonic energy through the elongated forward portion of the transmitter and into the meniscus of the fluid. In one embodiment, the transducer assembly can further comprise a housing with at least one opening for flowing a gas into a space in the housing in contact with the transducer.

Abstract: A method of cleaning a substrate comprises placing the substrate on a rotating fixture, placing a liquid on at least one side of the substrate, and creating a standing wave of megasonic energy oriented generally parallel to the substrate. The standing wave generates an associated pattern of high-agitation regions in the liquid. The method further comprises moving the standing wave back-and-forth so as to move the pattern of high-agitation regions about with respect to the substrate. An apparatus for cleaning substrates comprises a support to rotate the substrate about a first axis, and a transmitter extending generally parallel to a surface of the substrate. The apparatus further comprises a megasonic transducer in acoustically coupled relation to the transmitter, and a reciprocation drive in fixed relation to the transmitter. The reciprocation drive moves the transmitter back-and-forth within a plane generally parallel to the surface of the substrate.

Abstract: A method and system for cleaning and/or stripping photoresist from photomasks used in integrated circuit manufacturing comprising a process and means of introducing a mixture of sulfuric acid and ozone (or a mixture of sulfuric acid and hydrogen peroxide) to the surface of a photomask while applying megasonic energy. The invention also comprises method and system comprising a process and means of introducing ozonated deionized water and/or a low temperature dilute aqueous solution (dAPM) to the surface of photomasks while applying megasonic energy. The process and apparatus also remove post plasma ashed residues and other contaminants from photomask surfaces.

Abstract: A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

Abstract: A method of processing thin flat articles, particularly semiconductor wafers, utilizing sonic energy. In one aspect, the invention is a method comprising: supporting a substrate in a generally horizontal orientation and transmitting sonic energy to the substrate while flowing liquid onto both sides of the substrate to loosen particles on both sides of the substrate while maintaining said orientation. In another aspect, the invention is a cleaning method comprising: applying cleaning fluid to one side of a thin flat article while supporting the article in a generally horizontal orientation; and applying energy to the other one of the sides with sufficient power to produce vibration on the one side in the area of the cleaning fluid to loosen particles on the one side, while maintaining said orientation.

Abstract: A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.

Abstract: An apparatus for drying a generally flat substrate that has been cleaned has a rotatable support for supporting the substrate, a substrate drying assembly, and a controller. The substrate drying assembly includes a substrate drying assembly support arm, an outlet for applying liquid to an upper surface of the substrate, and an outlet for applying a drying vapor to the upper surface of the substrate. The substrate drying assembly is configured to position the liquid applying outlet and to position the vapor applying outlet above a portion of the substrate. The controller causes the substrate drying assembly to be retracted over the upper surface of the substrate at a faster rate near a center of the substrate than near a periphery of the substrate.

Abstract: In accordance with one embodiment there is provided a method of improving the performance of a substrate cleaner of the type having a megasonic probe with a probe shaft extending generally parallel to a surface of a rotating substrate, and at least one dispenser for applying a cleaning liquid onto the surface of the substrate, wherein the megasonic probe agitates the liquid on the surface. The method comprising dissolving gas in the liquid before the liquid reaches the dispenser. In accordance with another embodiment, an apparatus for cleaning substrates comprises a rotary fixture which is adapted to support a substrate and rotate the substrate about a first axis, a probe having a probe shaft extending generally parallel to a surface of the substrate, and a megasonic transducer in acoustically coupled relation to the probe.