Abstract: A method for producing a double-layer or triple-layer sound-absorbing panel (10) is specified, said panel consisting of a support panel (20) and at least one cover panel or coating (30, 35) of the support panel (20), the cover panel or coating (30, 35) being fixedly connected to the support panel (20). In this case, an open-pore (121) support panel is provided as the support panel (20) and the sound-absorbing panel (10) is arranged on each side (12, 13) provided with a cover panel or coating (30, 35) with a device opposing said side emitting a laser beam, the upper face (12) of said panel (10) being subjected to the laser beam, which is designed to burn away material from the cover panel or coating (30, 35) facing said laser beam over the depth in the direction of the laser beam in a plurality of holes (31).
Abstract: A method for producing a double-layer or triple-layer sound-absorbing panel (10) is specified, said panel consisting of a support panel (20) and at least one cover panel or coating (30, 35) of the support panel (20), the cover panel or coating (30, 35) being fixedly connected to the support panel (20). In this case, an open-pore (121) support panel is provided as the support panel (20) and the sound-absorbing panel (10) is arranged on each side (12, 13) provided with a cover panel or coating (30, 35) with a device opposing said side emitting a laser beam, the upper face (12) of said panel (10) being subjected to the laser beam, which is designed to burn away material from the cover panel or coating (30, 35) facing said laser beam over the depth in the direction of the laser beam in a plurality of holes (31).
Abstract: The described and claimed soundproofing material is planar and has an inhomogeneous structure. It consists of a textile or mesh having relatively thick, adjacent longitudinal components and relatively thin components running in the transverse direction at a spacing from one another. Longitudinal microslits are formed between the longitudinal components by the distribution of the thin transverse components. The width of the microslits amounts to 0.01 and 0.4 mm, and the thickness of the longitudinal components amounts to at least five to ten times that of the microslits.