Abstract: Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members.
Type:
Grant
Filed:
May 4, 2011
Date of Patent:
August 26, 2014
Assignee:
Alatech Semiconductor
Inventors:
Philippe Gastaldo, Frederic Pernot, Olivier Piffard
Abstract: Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members.
Type:
Application
Filed:
May 4, 2011
Publication date:
February 21, 2013
Applicant:
ALATECH SEMICONDUCTOR
Inventors:
Philippe Gastaldo, Frederic Pernot, Olivier Piffard