Abstract: An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.

Abstract: An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.

Abstract: An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.

Abstract: Systems and methods convey information from a controller to at least one slave unit using a single wire referenced to an alternating current (AC) power supply. A control signal has a high voltage and a low voltage. The high voltage is greater than a voltage midpoint of the AC power supply and the low voltage is less than the voltage midpoint. The control signal is conveyed through the single wire to each of the at least one slave unit. At each slave unit, a comparison voltage, representative of the voltage midpoint, is generated by dividing substantially midway the potentials between the power lines of the AC power supply and the control signal is compared to the comparison voltage to determine low and high states of the control signal; the low and high states represent the information.

Abstract: A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.

Abstract: A flow-through LED lighting system includes a housing and two or more blades disposed with the housing. At least one blade has a plurality of LEDs mounted therewith, and each blade is separated from an adjacent blade by a venting space. A power supply is configured with the housing, connects with an external power source, and powers the LEDs.

Abstract: Systems and methods convey information from a controller to at least one slave unit using a single wire referenced to an alternating current (AC) power supply. A control signal has a high voltage and a low voltage. The high voltage is greater than a voltage midpoint of the AC power supply and the low voltage is less than the voltage midpoint. The control signal is conveyed through the single wire to each of the at least one slave unit. At each slave unit, a comparison voltage, representative of the voltage midpoint, is generated by dividing substantially midway the potentials between the power lines of the AC power supply and the control signal is compared to the comparison voltage to determine low and high states of the control signal; the low and high states represent the information.

Abstract: An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.

Abstract: A power supply for powering one or more loads includes a boost circuit with power factor correction (PFC) that provides an operating voltage from an electrical power source, and a dimmer detection circuit that determines a dimming level applied to the electrical power source, and generates a pulse width modulated (PWM) signal based upon the dimming level. The power supply also includes one or more current control circuits, each current control circuit being associated with each of the one or more loads, and coupled in series with the operating voltage, its associated load, and a ground of the power supply, so as to control a current through its associated load in response to the PWM signal.

Abstract: A socketable LED light bulb includes a fixture for contacting power connections of a standard light bulb socket, a stem that connects one or more LEDs with the fixture, and an electronics housing configured with at least one electronic component for regulating power supplied to the one or more LEDs. The electronics housing is along the stem between the one or more LEDs and the fixture. Another socketable LED light bulb includes a fixture for contacting power connections of a standard light bulb socket, and a power converter that transmits the output voltage to flexible circuitry to power one or more LEDs. A shell provides mechanical support for the flexible circuitry, and forms apertures through which the one or more LEDs emit light.

Abstract: A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.

Abstract: An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture.

Abstract: A power supply for powering one or more loads includes a boost circuit with power factor correction (PFC) that provides an operating voltage from an electrical power source, and a dimmer detection circuit that determines a dimming level applied to the electrical power source, and generates a pulse width modulated (PWM) signal based upon the dimming level. The power supply also includes one or more current control circuits, each current control circuit being associated with each of the one or more loads, and coupled in series with the operating voltage, its associated load, and a ground of the power supply, so as to control a current through its associated load in response to the PWM signal.

Abstract: A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.

Abstract: Systems and methods convey information from a controller to at least one slave unit using a single wire referenced to an alternating current (AC) power supply. A control signal has a high voltage and a low voltage. The high voltage is greater than a voltage midpoint of the AC power supply and the low voltage is less than the voltage midpoint. The control signal is conveyed through the single wire to each of the at least one slave unit. At each slave unit, a comparison voltage, representative of the voltage midpoint, is generated by dividing substantially midway the potentials between the power lines of the AC power supply and the control signal is compared to the comparison voltage to determine low and high states of the control signal; the low and high states represent the information.

Abstract: Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.