Patents Assigned to Alesis Semiconductor, Inc.
  • Patent number: 6163197
    Abstract: An apparatus and method for interconnecting digital and analog circuitry on separate substrates within a single integrated chip package attenuates logic level signals on one substrate, transmits the attenuated signals to another substrate, and amplifies the attenuated signals back to logic level signals.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: December 19, 2000
    Assignee: Alesis Semiconductor, Inc.
    Inventors: Keith Barr, Frank Thomson