Abstract: An improved process for metallugically bonding two layers of metal capable of forming brittle intermetallics, by means of propelling one of the layers progressively into collision along the other layer at a velocity and impact angle selected to produce a substantially straight bond along a common interfacial region of contact between the layers; and includes the welded product formed thereby.
Type:
Grant
Filed:
February 10, 1988
Date of Patent:
June 27, 1989
Assignees:
Alfredo Bentivoglio, Richardo Rodriquez, Alexander Szecket
Abstract: An improved process for metallurgically bonding two layers of metal capable of forming brittle intermetallics, by means of propelling one of the layers progressively into collision along the other layer at a velocity and impact angle selected to produce a waveless, complete metal to metal bond substantially free of the formation of brittle intermetallics along the entire interfacial region of contact between said layers; and includes the welded product formed thereby.
Type:
Grant
Filed:
March 11, 1985
Date of Patent:
May 31, 1988
Assignees:
Alexander Szecket, Alfredo Bentivoglio, Ricardo Rodriguez