Patents Assigned to All Wet Technologies, Inc.
  • Patent number: 6540899
    Abstract: A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an elastomeric encased ring of flexible fingers against which the periphery of the workpiece underside is forced to deflect the fingers downwardly and engage a peripheral sealing bead against the underside periphery of the workpiece; and where electrical contact with the workpiece is desired, resiliently engaging electrical contact tips protruding through peripheral openings in the elastomeric covering within the sealing ring, with the underside periphery of the workpiece.
    Type: Grant
    Filed: April 5, 2001
    Date of Patent: April 1, 2003
    Assignee: All Wet Technologies, Inc.
    Inventor: Arthur Keigler
  • Publication number: 20020144900
    Abstract: A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an elastomeric encased ring of flexible fingers against which the periphery of the workpiece underside is forced to deflect the fingers downwardly and engage a peripheral sealing bead against the underside periphery of the workpiece; and where electrical contact with the workpiece is desired, resiliently engaging electrical contact tips protruding through peripheral openings in the elastomeric covering within the sealing ring, with the underside periphery of the workpiece.
    Type: Application
    Filed: April 5, 2001
    Publication date: October 10, 2002
    Applicant: All Wet Technologies, Inc.
    Inventor: Arthur Keigler