Abstract: A method of providing an electrical circuit wherein a carrier, which is a film of insulating plastic material with a circuit pattern thereon is supported in a mould and a moulding material is applied by the application of heat and pressure to provide a substrate so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.
Type:
Grant
Filed:
September 11, 1989
Date of Patent:
April 2, 1991
Assignee:
Allen-Bradley International Limited
Inventors:
Anthony Atkinson, Richard Gray, Oscar L. Denes
Abstract: A method of providing an electrical circuit wherein a carrier, which is a film of insulating plastic material with a circuit pattern thereon is supported in a mould and a moulding material is applied by the application of heat and pressure to provide a substrate so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.
Type:
Grant
Filed:
July 1, 1987
Date of Patent:
March 27, 1990
Assignee:
Allen-Bradley International Limited
Inventors:
Anthony Atkinson, Richard Gray, Oscar L. Denes