Patents Assigned to Alpha Assembly Solutions Inc.
  • Patent number: 12246376
    Abstract: A method of making a combined sinter-ready silver film and carrier comprises the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings, for example casting a silver paste; and c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier. The carrier may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier may comprise a stencil layer and a backing layer. The stencil layer may define the designed openings. The backing layer may be configured for sealing a bottom of the designed openings, wherein at the start of step b), a top of the designed openings may be open for receiving the cast silver film layer.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: March 11, 2025
    Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Oscar Khaselev, Matthew James Siebenhuhner, Monnir Boureghda, Mike Marczi, Carl Bilgrien
  • Patent number: 12233483
    Abstract: A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: February 25, 2025
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Rahul Raut, Nirmalyakumar Chaki, Bawa Singh, Ranjit Pandher, Siuli Sarkar
  • Publication number: 20250026645
    Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.
    Type: Application
    Filed: September 30, 2024
    Publication date: January 23, 2025
    Applicant: Alpha Assembly Solutions Inc.
    Inventors: Nirmalyakumar Chaki, Supriya Devarajan, Barun Das, Chetan Pravinchandra Shah, Venodh Manoharan, Rahul Raut, Bawa Singh, Ranjit Pandher
  • Publication number: 20240413117
    Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 ?m.
    Type: Application
    Filed: August 16, 2024
    Publication date: December 12, 2024
    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Anubhav Rustogi
  • Patent number: 12122679
    Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: October 22, 2024
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Nirmalya Kumar Chaki, Supriya Devarajan, Barun Das, Chetan Pravinchandra Shah, Venodh Manoharan, Rahul Raut, Bawa Singh, Ranjit Pandher
  • Patent number: 12115602
    Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: October 15, 2024
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Ranjit Pandher, Niveditha Nagarajan, Anil Kumar, Morgana de Avila Ribas, Gyan Dutt, Siuli Sarkar, Carl Bilgrien
  • Patent number: 12113039
    Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 ?m.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: October 8, 2024
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Siuli Sarkar, Anubhav Rustogi
  • Patent number: 12084583
    Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: September 10, 2024
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Narahari Pujari, Jayaprakash Sundaramurthy, Siuli Sarkar, Ravindra M. Bhatkal
  • Publication number: 20240282742
    Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
    Type: Application
    Filed: February 21, 2024
    Publication date: August 22, 2024
    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Shamik Ghosal, Remya Chandran, Venodh Manoharan, Siuli Sarkar, Bawa Singh, Rahul Raut
  • Patent number: 11929341
    Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: March 12, 2024
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Remya Chandran, Venodh Manoharan, Siuli Sarkar, Bawa Singh, Rahul Raut
  • Patent number: 11842974
    Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: December 12, 2023
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Angelo Gulino, Bogdan Bankiewicz, Oscar Khaselev, Anna Lifton, Michael T. Marczi, Girard Sidone, Paul Salerno, Paul J. Koep
  • Patent number: 11830640
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: November 28, 2023
    Assignee: Alpha Assembly Solutions, Inc.
    Inventors: Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
  • Publication number: 20230356333
    Abstract: A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 9, 2023
    Applicant: Alpha Assembly Solutions Inc.
    Inventors: Md Hasnine, Lik Wai Kho
  • Publication number: 20230340642
    Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
    Type: Application
    Filed: June 29, 2023
    Publication date: October 26, 2023
    Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Md Hasnine, Lik Wai Kho
  • Patent number: 11732330
    Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: August 22, 2023
    Assignee: Alpha Assembly Solutions, Inc.
    Inventors: Md Hasnine, Lik Wai Kho
  • Patent number: 11724342
    Abstract: A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: August 15, 2023
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Md Hasnine, Lik Wai Kho
  • Patent number: 11699632
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: July 11, 2023
    Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • Patent number: 11624000
    Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: April 11, 2023
    Assignees: Alpha Assembly Solutions Inc., MacDermid Autotype Limited
    Inventors: Nirmalya Kumar Chaki, Chetan Pravinchandra Shah, Barun Das, Supriya Devarajan, Siuli Sarkar, Rahul Raut, Bawa Singh, Anubhav Rustogi, Anna Jane Harris, Keith Paul Parsons, Jeffrey William Braham
  • Patent number: 11577343
    Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony. The alloy may further comprise nickel. The silver may be present in an amount from about 2.0% to 2.8% by weight of the solder. The copper may be present in an amount from about 0.2% to 1.2% by weight of the solder. The bismuth may be present in an amount from about 0.0% to about 5.0% by weight of the solder. In some embodiments, the bismuth may be present in an amount from about 1.5% to 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.001% to about 0.2% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.1% by weight of the solder. The balance of the solder is tin.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: February 14, 2023
    Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Md Hasnine, Lik Wai Kho
  • Patent number: 11411150
    Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: August 9, 2022
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Morgana de Avila Ribas, Pritha Choudhury, Siuli Sarkar, Ranjit Pandher, Nicholas G Herrick, Amit Patel, Ravindra M Bhatkal, Bawa Singh