Patents Assigned to Alpha Design Co., Ltd.
  • Patent number: 8915418
    Abstract: The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: December 23, 2014
    Assignees: Tadatomo Suga, Masataka Mizukoshi, Alpha Design Co., Ltd.
    Inventors: Toshiyuki Shiratori, Toru Kawasaki, Tadatomo Suga, Masataka Mizukoshi
  • Patent number: 8875977
    Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: November 4, 2014
    Assignee: Alpha Design Co., Ltd.
    Inventors: Toshiyuki Shiratori, Toru Kawasaki, Tadatomo Suga, Masataka Mizukoshi
  • Publication number: 20140263575
    Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: ALPHA DESIGN CO., LTD.
    Inventors: Toshiyuki SHIRATORI, Toru KAWASAKI, Tadatomo SUGA, Masataka MIZUKOSHI
  • Publication number: 20140263581
    Abstract: The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: ALPHA DESIGN CO., LTD.
    Inventors: Toshiyuki SHIRATORI, Toru KAWASAKI, Tadatomo SUGA, Masataka MIZUKOSHI
  • Patent number: D604132
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: November 17, 2009
    Assignee: Alpha Design Co., Ltd.
    Inventors: Masatoshi Satoh, Shinya Sakashita