Abstract: A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.

Abstract: A support and tensioning frame for a stencil to enable solderi paste to be applied to printed circuit boards and other electronic substrates comprising a support frame having four side members with at least two opposing side members having a stencil support surface which the stencil abuts and over which the stencil is flexed by two displaceable mounting bars disposed within opposing side members. The mounting bars are engaged with the stencil by a plurality of projections extending from a terminal edge of a mounting plate comprising each mounting bar which are sized for receipt by a plurality of apertures disposed along at least two side edges of the stencil. Each mounting bar is biased in an outwardly position by a plurality of compression springs disposed along each side member.

Abstract: A stencil of sheet metal for enabling solder paste to be applied to circuit boards includes a main body portion and opposite side regions which are apertured so as to be more flexible than the main body portion, and so as to enable these opposite side regions to be bent without kinking or other deformation during tensioning. The invention further includes an apparatus for enabling solder paste to be applied to a circuit board by a stenciling process, the apparatus including a stencil as described together with a support therefor, the stencil being attached to the support and being detachable therefrom. The side regions of the stencil are flexed for attachment to the support, so that the interconnection between the support and the stencil does not project beneath a lowermost planar surface of the stencil.