Patents Assigned to Alpha Metals, Inc.
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Publication number: 20160318134Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.Type: ApplicationFiled: December 31, 2014Publication date: November 3, 2016Applicant: Alpha Metals, Inc.Inventors: Morgana de Avila Ribas, Rahul Raut, Traian Cornel CUCU, Shu Tai Yong, Siuli Sarkar, Ramakrishna Hosur Katagiriyappa
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Publication number: 20160304989Abstract: A method for recovering tin and/or tin alloy from a substrate comprising providing a substrate having tin and/or tin alloy thereon; contacting the tin and/or tin alloy with a stripping solution comprising an inorganic acid and a persulfate compound; recovering tin salt and/or tin alloy salt precipitated from the stripping solution; and recovering tin and/or tin alloy from the tin salt and/or tin alloy salt, respectively.Type: ApplicationFiled: July 2, 2014Publication date: October 20, 2016Applicant: Alpha Metals, Inc.Inventors: Narahari Pujari, Siuli Sarkar, Bawa Singh, Daniel Goswami
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Publication number: 20160214213Abstract: A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.Type: ApplicationFiled: December 28, 2015Publication date: July 28, 2016Applicant: ALPHA METALS, INC.Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20160175994Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminium surfaces solderable using the flux and conventional solders.Type: ApplicationFiled: August 29, 2014Publication date: June 23, 2016Applicant: ALPHA METALS, INC.Inventors: Ranjit Pandher, Bawa Singh, Rahul Raut, Arora Sanyogita, Ravindra Bhatkal, Bin Mo
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Publication number: 20160144462Abstract: A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.Type: ApplicationFiled: December 28, 2015Publication date: May 26, 2016Applicant: ALPHA METALS, INC.Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20160107267Abstract: An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package comprising no more than 3 wt.% bismuth, from 0.15-1.5 wt.% copper, from 0.1-1.5 wt.% silver, and the balance tin, with optionally other alloying elements in certain embodiments, together with unavoidable impurities.Type: ApplicationFiled: December 22, 2015Publication date: April 21, 2016Applicant: ALPHA METALS, INC.Inventors: Anthony Ingham, Gerard Campbell, Brian G. Lewis, Bawa Singh, John P. Laughlin, Ranjit Pandher
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Publication number: 20160023309Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.Type: ApplicationFiled: October 8, 2015Publication date: January 28, 2016Applicant: ALPHA METALS, INC.Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
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Patent number: 9221131Abstract: An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.Type: GrantFiled: December 1, 2005Date of Patent: December 29, 2015Assignee: Alpha Metals, Inc.Inventors: Anthony E. Ingham, Gerard Campbell, Brian G. Lewis, Bawa Singh, John P. Laughlin, Ranjit Pandher
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Patent number: 9217088Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.Type: GrantFiled: June 24, 2011Date of Patent: December 22, 2015Assignee: ALPHA METALS, INC.Inventors: Sachin Parashar, Siuli Sarkar, Oscar Khaselev, Brian G. Lewis, Michael T. Marczi, Bawa Singh, Nitin Desai, Michael Liberatore
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Publication number: 20150353804Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 29, 2013Publication date: December 10, 2015Applicant: ALPHA METALS, INC.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20150266137Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.Type: ApplicationFiled: October 9, 2013Publication date: September 24, 2015Applicant: ALPHA METALS, INC.Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
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Publication number: 20150224604Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.Type: ApplicationFiled: April 28, 2015Publication date: August 13, 2015Applicant: ALPHA METALS, INC.Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
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Publication number: 20140219711Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.Type: ApplicationFiled: August 2, 2012Publication date: August 7, 2014Applicant: ALPHA METALS, INC.Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20140199115Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.Type: ApplicationFiled: August 2, 2012Publication date: July 17, 2014Applicant: ALPHA METALS, INC.Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi
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Publication number: 20140186524Abstract: Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.Type: ApplicationFiled: December 3, 2013Publication date: July 3, 2014Applicant: ALPHA METALS, INC.Inventors: Oscar Khaselev, Michael T. Marczi, Bawa Singh, Nitin Desai
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Publication number: 20140153203Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: ApplicationFiled: September 16, 2013Publication date: June 5, 2014Applicant: ALPHA METALS, INC.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Publication number: 20140153167Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.Type: ApplicationFiled: October 21, 2013Publication date: June 5, 2014Applicant: ALPHA METALS, INC.Inventors: Rajan Hariharan, James Hurley, Senthil Kanagavel, Jose Quinones, Martin Sobczak, Deborah Makita
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Patent number: 8597548Abstract: Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.Type: GrantFiled: September 19, 2007Date of Patent: December 3, 2013Assignee: Alpha Metals, Inc.Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
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Patent number: 8564140Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.Type: GrantFiled: September 25, 2009Date of Patent: October 22, 2013Assignee: Alpha Metals, Inc.Inventors: Rajan Hariharan, James Hurley, Senthil Kanagavel, Jose Quinones, Martin Sobczak, Deborah Makita
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Patent number: 8555491Abstract: Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.Type: GrantFiled: July 17, 2008Date of Patent: October 15, 2013Assignee: Alpha Metals, Inc.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh