Abstract: An apparatus and method of material bonding using captive plungers is disclosed. In one embodiment, an apparatus includes a base plate to have multiple holes in an array, multiple captive plungers each surrounded by a compressible spring to couple to the multiple holes in such a way which allows each of the multiple captive plungers to vertically move in a confine of each of the multiple holes corresponding to the each of the multiple captive plungers, and a fastening device to apply a force to bond two or more parts placed on top of each other with a bonding material in between the two or more parts through pressing the base plate to the two or more parts such that the force delivered through the multiple captive plungers to the two or more parts is concentrated to the array.