Patents Assigned to Altera Corpoartion
  • Patent number: 10476505
    Abstract: A semiconductor die includes at least one flexible interface block. The flexible interface block includes at least one interconnect, and at least one buffer coupled to the at least one interconnect. The flexible interface block further includes a routing interface coupled to circuitry integrated in the semiconductor die, and a controller coupled to provide communication between the routing interface and the at least one buffer.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: November 12, 2019
    Assignee: Altera Corpoartion
    Inventor: Tony K. Ngai