Abstract: A processing integrated circuit includes a processing core comprising hard logic circuits and a programmable interface circuit configurable to exchange signals between an external terminal of the processing integrated circuit and the hard logic circuits in the processing core.

Abstract: Systems or methods of the present disclosure may provide efficient circuit implementation on processing circuitry. The processing circuitry may include a processor, a programmable hardware, or both. The systems and methods may include determining and removing unused and/or redundant portions of predefined software and hardware description instructions before implementing associated circuitry. The implemented circuitry may perform various functions including parsing, pipelining, deparsing, temporary storage and combining, math operations, or a combination thereof, among other things.

Abstract: This disclosure is directed to methods of disaggregating columnar IO operations from a programmable logic fabric using 3-D packaging technology. More specifically, methods of 3-D programmable fabric arrangements that include one or more IO chiplets stacked in a 3-D orientation on a programmable logic fabric main die that includes one or more D2D drivers to enable communication between the one or more IO chiplets and the programmable logic fabric main die. The IO chiplets may be coupled to the programmable fabric main die through connection to the one or more D2D drivers arranged on the programmable fabric main die.

Abstract: A configurable integrated circuit includes a network-on-chip and a response buffer circuit coupled to the network-on-chip. The response buffer circuit includes a direct memory access circuit and a controller circuit. The direct memory access circuit generates read requests and write requests to access memory circuits. The controller circuit provides the read requests and the write requests to the memory circuits through the network-on-chip. The controller circuit exchanges data with the memory circuits for the read requests and the write requests.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed. An example apparatus includes: instructions; and processor circuitry to execute the instructions to: retrieve a random number and a physical unclonable function (PUF) from a trusted environment; generate a virtual PUF (vPUF) based on a trusted operation including the random number and the PUF; and store the vPUF and the random number in a persistent storage.

Abstract: A semiconductor device may include a programmable fabric and a processor. The processor may utilize one or more extension architectures. At least one of these extension architectures may be used to integrate and/or embed the programmable fabric into the processor as part of the processor. Specifically, a buffer of the extension architecture may be used to load data to and store data from the programmable fabric.

Abstract: An integrated circuit includes a multiplexer circuit coupled to receive a first clock signal and a second clock signal and coupled to provide an output clock signal to a channel. A protection circuit is coupled to receive a feedback signal from the channel. The protection circuit causes the multiplexer circuit to provide oscillations in the second clock signal to the output clock signal in response to the feedback signal indicating that the channel is idle to cause the channel to be in a protection mode that reduces degradation from bias temperature instability. The protection circuit causes the multiplexer circuit to provide oscillations in the first clock signal to the output clock signal in response to the feedback signal indicating that the channel is active.

Abstract: An integrated circuit includes a first input/output lane comprising first external terminals and first driver circuits. The first driver circuits exchange signals with a first external device through the first external terminals as part of a first external interface. The first input/output lane is part of a sub-bank in an input/output bank that implements at least a part of the first external interface. The integrated circuit includes a second input/output lane comprising second external terminals and second driver circuits. The second driver circuits exchange signals with a second external device through the second external terminals as part of a second external interface. The second input/output lane is part of the sub-bank in the input/output bank that implements at least a part of the second external interface.

Abstract: An accelerated processor structure on a programmable integrated circuit device includes a processor and a plurality of configurable digital signal processors (DSPs). Each configurable DSP includes a circuit block, which in turn includes a plurality of multipliers. The accelerated processor structure further includes a first bus to transfer data from the processor to the configurable DSPs, and a second bus to transfer data from the configurable DSPs to the processor.

Abstract: A circuit system includes a processing circuit, an accelerator circuit, and a buffer circuit that stores packets of data and that is coupled to the processing circuit and to the accelerator circuit. The buffer circuit functions as a crossbar circuit by allowing each of the accelerator circuit and the processing circuit to access at least one of the packets of data stored in the buffer circuit during access to another one of the packets of data stored in the buffer circuit.

Abstract: A configurable integrated circuit includes first logic circuits, second logic circuits, and a crossbar switch circuit. The crossbar switch circuit includes multiplexer circuits and input busses coupled to the multiplexer circuits. The inputs of each of the multiplexer circuits are coupled to each of the input busses. The configurable integrated circuit is configurable to provide input signals generated by the first logic circuits to the inputs of each of the multiplexer circuits through the input busses. The multiplexer circuits are configurable to provide values of the input signals that are received through the input busses to the second logic circuits.

Abstract: Systems or methods of the present disclosure may provide a programmable logic device including a network-on-chip (NoC) to facilitate data transfer between one or more main intellectual property components (main IP) and one or more secondary intellectual property components (secondary IP). To reduce or prevent excessive congestion on the NoC, the NoC may include one or more traffic throttlers that may receive feedback from a data buffer, a main bridge, or both and adjust data injection rate based on the feedback. Additionally, the NoC may include a data mapper to enable data transfer to be remapped from a first destination to a second destination if congestion is detected at the first destination.

Abstract: Examples relate to an apparatus, device, method, and computer program for generating logic to be performed by computing circuitry of a computing architecture. The apparatus is configured to determine a performance-critical compute path of a compute kernel to be executed on a plurality of units of computing circuitry of a computing architecture, the compute kernel comprising a plurality of interdependent groups of computational instructions, with the performance-critical compute path being based on a subset of the interdependent groups of computational instructions. The apparatus is configured to determine, for at least one group of computational instructions outside the performance-critical compute path, a reduced clock frequency being lower than a maximally feasible clock frequency of the respective group of computational instructions.

Abstract: An integrated circuit device includes multiple microbumps and a top programmable fabric die including a first programmable fabric and a first microbump interface coupled to the multiple microbumps. The integrated circuit device also includes a base programmable fabric die having a second programmable fabric and a second microbump interface coupled to the first microbump interface via a coupling to the multiple microbumps. The top programmable fabric die and the base programmable fabric die have a same design. Moreover, the top programmable fabric die and the base programmable fabric die are arranged in a three-dimensional die arrangement with the top programmable fabric die flipped above the base programmable fabric die.

Abstract: A reticle-stitched integrated circuit is provided. The reticle-stitched integrated circuit extends over a first die area and a second die area of an integrated circuit wafer. While individually the first die area and the second die area are within their respective reticle limits, collectively the first die area and the second die area exceed the reticle limit. A first layer of the reticle-stitched integrated circuit may have communication wires that remain exclusively in only one of the first die area and the second die area. A second layer of the reticle-stitched integrated circuit may have communication wires that overlap the first die area and the second die area, thereby allowing communication between the two die areas and enabling the reticle-stitched integrated circuit to exceed the limit of the reticle.

Abstract: A method is provided for using an integrated circuit design tool to optimize a circuit design for an integrated circuit. Optimizations that affect first circuits in the circuit design and that are performed during synthesis of the circuit design for the integrated circuit are recorded in first records in a database. Second records are recorded in the database that indicate second circuits in the circuit design that fanin to or fanout from the first circuits and that are affected by the optimizations. A root cause of at least one of the optimizations is determined using the first and the second records in the database. A sequence of the optimizations affecting the first and the second circuits is determined using the first and the second records in the database.

Abstract: A processor circuit includes a first front-end circuit for scheduling first instructions for a first program and a second front-end circuit for scheduling second instructions for a second program. A back-end processing circuit processes first operations in the first instructions and second operations in the second instructions. A multi-program scheduler circuit causes the first front-end circuit to schedule processing of the first operations on the back-end processing circuit and causes the second front-end circuit to schedule processing of the second operations on the back-end processing circuit. A processor generator system includes a processor designer that creates specifications for a processor using workloads for a program, a processor generator that generates a first processor instance using the specifications, a processor optimizer that generates a second processor instance using the workloads, and a co-designer that modifies the program using the second processor instance.

Abstract: Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.

Abstract: Various embodiments provide apparatuses, systems, and methods to determine a figure of merit (FOM) of a communication link (e.g., a serial communication link, also referred to herein as a channel) between a transmitter and a receiver. The FOM may be used to, for example, determine a health of the communication link during mission mode (normal operating mode), determine a modulation scheme to use for the communication link, determine a configuration to use for the receiver and/or transmitter, and/or another suitable use case. Other embodiments may be described and claimed.

Abstract: This disclosure is directed to a digital signal processing (DSP) block that includes multiple weight registers configurable to receive and store a first plurality of values having multiple precisions, and multiple multipliers that are each configurable to receive a respective value of the first plurality of values. The DSP block further includes one or more inputs configurable to receive a second plurality of values, and a multiplexer network configurable to receive the second plurality of values and route each respective value of the second plurality of values to a multiplier of the multipliers. The multipliers are configurable to simultaneously multiply each value of the first plurality of values by a respective value of the second plurality of values to generate a plurality of products. Additionally, the DSP block includes adder circuitry configurable to generate a first sum and a second sum based on the plurality of products.