Abstract: A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Abstract: A measuring system (200) for measuring a FOV of a digital camera module (52) includes a measuring chart (22), a parameter inputting module (32), and a processing module (42). The measuring chart defines a colored portion. The parameter inputting module is used to input relative parameters. The processing module is connected to the parameter inputting module and receives electronic image signals converted from images of the colored portion and of the measuring chart screened by the lens module. The processing module is configured for calculating the FOV ? of the digital camera module. A measuring method for measuring the FOV ? of the digital camera module is also provided.

Abstract: A digital camera module packaging method includes: first, providing a carrier (20) including a base (21) defining a chamber (214) and a lead frame (23). The lead frame has a plurality of conduction pieces (233) embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip (30) with a photosensitive area (301) and a plurality of chip pads (302) is then mounted in the chamber. A plurality of wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder (50) is then provided. The carrier is mounted to the holder. Finally, a lens module (70) is mounted on the holder.

Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

Abstract: A lens auto-focusing method in camera module testing includes the following steps: providing testing equipment including a range finder, a signal processor and a driving member; providing an imaged object (20); providing an camera module including a lens module (10) and an image sensor, the view angle and the biggest value of the modulation transfer function of the lens module are both certain values, the image (30) of the imaged object is formed in the image sensor; the imaged object and the image formed thereby in the other side of the lens module are fixed; the imaged object and the image formed in the other side of the lens module are fixed; inputting an image distance tested by the range finder into the signal processor, the signal processor calculates a displacement for the driving member; the driving member drives the lens module to a focusing point.

Abstract: An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.

Abstract: An exemplary camera mechanism (8) includes a lens module (10), an image sensor module (20), an electronic module (30), and a transmission module (40). The image sensor module is mounted under the lens module. The electronic module is mounted to at least one of the lens module and the image sensor module. The transmission module has a main body (41), a first electronic connection end (43) and a second electronic connection end (45). The lens module and the image sensor module are mounted on the main body. The first electronic connection end is formed at a top end of the main body. The second electronic connection end is formed at a bottom end of the main body. The first electronic connection end is electrically connected to the electronic module and to the second electronic connection end, and the second electronic connection end is capable of being electrically connected to a mother board (50).

Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

Abstract: An image sensor package method includes the steps of: first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

Abstract: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

Abstract: A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.

Abstract: A reflection-testing device for testing for unwanted reflections in a lens module (12) includes a plurality of light sources (18) and an image capturer (16). The plurality of light sources is provided around the top end of the lens module, and the image capturer is provided near the other end of the lens module for receiving optical signals through the lens module. A lens reflection testing method is also disclosed.

Abstract: A camera module (100) includes a lens module (10) and an image sensor (20), wherein the lens module includes a barrel (12), a plurality of lenses (14) and at least one spacer between each two neighboring lenses. The barrel includes an inner wall (122), the lenses and the spacer both are received in the barrel; the image sensor is located on an imaging plane of the plurality of lenses. At least one through slot (18) is defined in at least one item selected from the group consisting of lenses, spacer, and between the lenses and spacer. At least one groove (124) is defined between the inner wall of the barrel and the group consisting of the lenses, spacer and the image sensor. The at least one through slot communicates with at least one groove.

Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

Abstract: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

Abstract: A lens module (200) includes a barrel (20), a lens (30) and a shielding layer (51). The barrel includes a screening end (21) and a mounting end (22) positioned opposite to the screening end, and defines an aperture (23) in the screening end. A diameter of the aperture reduces in a direction from the screening end to the mounting end so that the aperture has a large diameter and a small diameter. The lens is received in the barrel. The shielding layer made of an opaque film is mounted on the screening end and defines a receiving hole (511) aligned with the aperture. The receiving hole has a diameter being in a range of the large diameter and the small diameter.

Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.

Abstract: A measuring system (200) for measuring a FOV of a digital camera module (52) includes a measuring chart (22), a parameter inputting module (32), and a processing module (42). The measuring chart defines a colored portion. The parameter inputting module is used to input relative parameters. The processing module is connected to the parameter inputting module and receives electronic image signals converted from images of the colored portion and of the measuring chart screened by the lens module. The processing module is configured for calculating the FOV ? of the digital camera module. A measuring method for measuring the FOV ? of the digital camera module is also provided.

Abstract: A clamping device (100) for clamping a digital camera module (300) includes a base (12) and two legs (14). Two legs extend from two sides of the base. Each leg has at least one foot (18). The at least one foot defines an arcuate surface (180). The arcuate surfaces cooperatively define a space for receiving the digital camera module.