Patents Assigned to Amada
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Publication number: 20180165841Abstract: The present subject matter relates to generation of a geometry corresponding to a cross-sectional profile of an object. In an example method, a sketch corresponding to the cross-sectional profile of the object is received by a computing device. The sketch is drawn by moving a pointer over a display unit of the computing device. Pixel points generated by the display unit are obtained by the computing device. The pixel points correspond to the sketch. Low-speed pixel points, from amongst the pixel points, are joined with straight lines. The low-speed pixel points are the pixel points at which a speed of drawing of the sketch is below a predefined speed threshold. The straight lines are processed by the computing device into the geometry of the object.Type: ApplicationFiled: June 8, 2016Publication date: June 14, 2018Applicant: AMADA HOLDINGS CO., LTD.Inventor: Jackson THOLATH
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Patent number: 9975165Abstract: A rotatable buffer turret apparatus on which plural pairs of punches and dies to be set on a turret of a turret punch press are set, includes an upper buffer turret on which punch attachment holes in which the punches can be set are arranged circularly, and a lower buffer turret on which die attachment holes that is associated with the punch attachment holes and in which the dies can be set are arranged circularly. The upper and lower buffer turrets are rotatably attached to a single rotary shaft. A diameter of the lower buffer turret is made larger than a diameter of the upper buffer turret. The die attachment holes are formed in a circular die attachment area having a diameter larger than the diameter of the upper buffer turret. According to the apparatus, a tool exchange manually operated by an operator can be done easily and efficiently.Type: GrantFiled: September 28, 2017Date of Patent: May 22, 2018Assignee: AMADA COMPANY, LIMITEDInventors: Keiichi Sugiyama, Syuuji Ishida, Tomotake Iwamoto, Youichi Tanaka
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Patent number: 9975161Abstract: In a tool storing device handling a tool mounting stocker in which a punch and a die of a press brake are mounted in one stocker with rear surfaces facing each other, each of the stockers is supported on both sides by endless belts having one driving shaft, and the endless belts are circulated so that each of the supported stockers does not protrude to a worker side, whereby a position of a path line of the appropriate one of the stockers can be freely positioned at a position of the path line PL of a tool holder on the press brake side. This enables rapid and easy tool replacement by a bending robot by storing not only the tool made of the punch and the die but also the hand for the robot together.Type: GrantFiled: April 10, 2013Date of Patent: May 22, 2018Assignee: AMADA CO., LTD.Inventor: Masaaki Sato
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Publication number: 20180111230Abstract: A laser processing machine for carrying out hole-forming on a plate-shaped workpiece is provided. A first program storage that stores a plurality of hole-forming programs and a second program storage that stores a plurality of cutout piece drop programs are also provided. A program selector that selects, from the second program storage, a cutout piece drop program associated with a hole-forming program selected from the first program storage to form the hole on the workpiece. A working head controller that controls a laser processing head according to the hole-forming program and the cutout piece drop program that are selected is also provided. A motion path of the processing head after forming the hole on the workpiece and a jetting condition of assist gas to an inside of the outline from the processing head on the motion path are programed in each of the plurality of cutout piece drop programs.Type: ApplicationFiled: December 22, 2017Publication date: April 26, 2018Applicant: AMADA HOLDINGS CO., LTD.Inventor: Shoichi IMAYA
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Publication number: 20180111229Abstract: A basic loading and unloading system comprising a laser, shuttle, and controller, a module being added to the system in a manner whereby neither the laser, shuttle or controller needs to be physically modified.Type: ApplicationFiled: October 20, 2016Publication date: April 26, 2018Applicant: Amada America, Inc.Inventors: Michael Beransky, Mihai Cioclei, Alexey Volovik, Jonas Gutierrez, Fred Cortez, Karapet Kirishchyan
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Patent number: 9917416Abstract: A semiconductor laser oscillator includes a diode unit configured from a plurality of banks, in which one bank is configured from a plurality of laser diodes connected in series. The diode unit includes a wavelength locking mechanism for locking to a plurality of wavelengths. The semiconductor laser oscillator includes a controller configured to control input currents to the laser diodes of each of the plurality of banks individually in correspondence to a characteristic of a wavelength locking efficiency, and to control an output of the diode unit as a whole to a required output.Type: GrantFiled: October 13, 2015Date of Patent: March 13, 2018Assignees: AMADA HOLDINGS CO., LTD., LUMENTUM OPERATIONS LLCInventors: Kaori Usuda, Minoru Ogata
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Patent number: 9878381Abstract: A horizontal band saw machine includes a pair of jaws, a pair of saw blade wheels, a band saw blade looped over the saw blade wheels, a pair of saw blade guides, a contact guide attached to the other of the pair of jaws, a coupling bracket connected to the other of the pair of saw blade guides to locate a distal end thereof below the other of the pair of saw blade wheels, and a follower member provided at the distal end of the coupling bracket. The contact guide and the coupling bracket are configured to move one of the pair of saw blade guides until the follower member contacts with the contact guide when the band saw blade is fed circularly in a state where the band saw blade is clamped by the one of the pair of saw blade guides.Type: GrantFiled: July 2, 2014Date of Patent: January 30, 2018Assignees: AMADA HOLDINGS CO., LTD., AMADA MACHINE TOOLS CO., LTD.Inventors: Norihisa Sakai, Akio Seto
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Publication number: 20180026425Abstract: A semiconductor laser oscillator includes laser diode modules. A temperature sensor directly or indirectly detects a temperature of at least one of the laser diode modules. A collimating lens collimates respective lasers emitted from the laser diode modules. A grating performs spectrum beam coupling for the lasers emitted from the collimating lens. An incident angle varying mechanism changes incident angles of the respective lasers, at which the lasers emitted from the collimating lens are incident onto the grating in response to the temperature detected by the temperature sensor.Type: ApplicationFiled: March 1, 2016Publication date: January 25, 2018Applicant: AMADA HOLDINGS CO., LTD.Inventor: Kaori USUDA
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Publication number: 20180015619Abstract: A bending robot takes out a workpiece stored on a stacker while contacting its end face with a storage reference flat plane of the stacker, and then supplies it to a bending machine. The bending robot includes a main body movable parallel to the storage reference flat plane, an arm portion supported by the main body and capable of positioning above the stacker, and a distance sensor provided in the arm portion for measuring a distance to the workpiece stored on the stacker in a contactless manner. According to the bending robot, bending can be done with high efficiency.Type: ApplicationFiled: January 28, 2016Publication date: January 18, 2018Applicant: AMADA HOLDINGS CO., LTD.Inventors: Tetsuaki KATO, Atsushi YAMAGISHI, Daiya UCHIDA
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Publication number: 20180015525Abstract: A rotatable buffer turret apparatus on which plural pairs of punches and dies to be set on a turret of a turret punch press are set, includes an upper buffer turret on which punch attachment holes in which the punches can be set are arranged circularly, and a lower buffer turret on which die attachment holes that is associated with the punch attachment holes and in which the dies can be set are arranged circularly. The upper and lower buffer turrets are rotatably attached to a single rotary shaft. A diameter of the lower buffer turret is made larger than a diameter of the upper buffer turret. The die attachment holes are formed in a circular die attachment area having a diameter larger than the diameter of the upper buffer turret. According to the apparatus, a tool exchange manually operated by an operator can be done easily and efficiently.Type: ApplicationFiled: September 28, 2017Publication date: January 18, 2018Applicant: AMADA COMPANY, LIMITEDInventors: Keiichi SUGIYAMA, Syuuji ISHIDA, Tomotake IWAMOTO, Youichi TANAKA
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Publication number: 20170368634Abstract: A laser cutting method and a laser cutting apparatus cut a metallic work with a laser beam of a one-micrometer waveband. The method and apparatus carry out the laser cutting of the work with a ring beam RB passed through a focus position of a condenser lens 13 and having inner and outer diameters that tend to expand. The outer diameter of the ring beam is in a range of 300 ?m (micrometers) to 600 ?m, an inner diameter ratio of the same is in a range of 30% to 70%, and a focal depth of the condenser lens is in a range of 2 mm to 5 mm.Type: ApplicationFiled: September 11, 2017Publication date: December 28, 2017Applicant: AMADA COMPANY, LIMITEDInventors: Akihiko SUGIYAMA, Hiroaki ISHIGURO
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Patent number: 9849544Abstract: A laser processing program creation device sets an evaluation region in an adjacent plane to a target plane; calculates the position of the extremity of the product profile in the axial direction within the evaluation region; sets a first line segment passing through the position of the extremity and extending orthogonally to the axis in the target plane; locates a processing area in the range surrounded by the first line segment, a second line segment, and the product profile, the second line segment extending in the axial direction from an end of the first line segment to the product profile; allocates a trajectory for laser beam cutting to form a notch or a hole in the processing area; and allocates a trajectory for laser beam cutting to cut the material along the product profile.Type: GrantFiled: January 22, 2014Date of Patent: December 26, 2017Assignee: AMADA HOLDINGS CO., LTD.Inventor: Takaaki Ootsu
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Publication number: 20170348752Abstract: A punch die is provided. The punch die includes a punch body, a punch guide configured to removably receive the punch body therein, a retainer collar detachably coupled to the punch guide, a punch head mated to the punch body to regulate a position of the punch body, and a spring interposed between the punch head and the retainer collar. The punch guide includes a peripheral slot defined on the internal periphery of the punch guide such that the peripheral slot intersects a keyway of the punch guide. The retainer collar includes a cylindrical projection that extends into the inner periphery of the punch guide and an engaging projection defined on an outer periphery of the cylindrical projection. The engaging projection is rotatable to engage the peripheral slot and to be releasably aligned with the keyway.Type: ApplicationFiled: August 22, 2017Publication date: December 7, 2017Applicant: AMADA HOLDINGS CO., LTD.Inventors: Shigeru ENDO, Hiroshi NAKAI
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Patent number: 9833829Abstract: A punch die includes: a punch body including a punch edge portion at a lower end portion along an axis, a key projecting from an outer periphery, and a punch driver at an upper portion along the axis; a punch guide including an inner hollow elongated along the axis and receiving the punch body to be movable along the axis, and a keyway formed on an internal periphery of the inner hollow to extend along the axis and mesh with the key; a retainer collar rotatably combined with the punch guide at an upper end along the axis and around the axis, the punch driver passing through the retainer collar to be movable along the axis; and a punch head screwed in an upper end portion along the axis of the punch driver to regulate a position of the punch driver.Type: GrantFiled: February 19, 2014Date of Patent: December 5, 2017Assignee: AMADA HOLDINGS CO., LTD.Inventors: Shigeru Endo, Hiroshi Nakai
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Publication number: 20170336779Abstract: In a machining system that conducts nesting to arrange parts over a workpiece and machines the workpiece with a machine tool according to a result of the nesting, there is an automatic programming device for preparing a nesting machining program for the machine tool, wherein nested workpiece information relating to the workpiece nested is acquired according to the information relating to the parts and the information relating to the workpiece, sections that require no re-nesting in the nested workpiece information are locked according to the operator's designation, re-nesting is conducted on sections other than the locked sections.Type: ApplicationFiled: August 7, 2015Publication date: November 23, 2017Applicant: AMADA HOLDINGS CO., LTD.Inventors: Tsutomu NAKATA, Chitra Malini THANAPANDI, Ravindran DHANABALAN
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Patent number: 9821391Abstract: A saw blade includes a group A (group A1 [=straight tooth+the odd number of set teeth]+group A2 [=straight tooth+the even number of set teeth]) and a group B (group B1 [=straight tooth+the odd number of set teeth having opposite set-bending sides to those in the group A1]+group B2 [=straight tooth+the even number of set teeth having opposite set-bending sides to those in the group A2]). Wide and narrow set teeth are arranged so that a max/min ratio of the number of pitches between the narrow set teeth having identical set-bending side and set width is 1.8 or less, and a max/min ratio of the number of pitches between the wide set teeth having identical set-bending side set width is 2.7 or less.Type: GrantFiled: July 1, 2013Date of Patent: November 21, 2017Assignees: AMADA COMPANY, LIMITED, AMADA MACHINE TOOLS COMPANY, LTD.Inventors: Susumu Tsujimoto, Takeshi Ueyama
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Patent number: 9821409Abstract: A laser cutting method and a laser cutting apparatus cut a metallic work with a laser beam of a one-micrometer waveband. The method and apparatus carry out the laser cutting of the work with a ring beam RB passed through a focus position of a condenser lens 13 and having inner and outer diameters that tend to expand. The outer diameter of the ring beam is in a range of 300 ?m (micrometers) to 600 ?m, an inner diameter ratio of the same is in a range of 30 % to 70 %, and a focal depth of the condenser lens is in a range of 2 mm to 5 mm.Type: GrantFiled: September 13, 2012Date of Patent: November 21, 2017Assignee: AMADA COMPANY, LIMITEDInventors: Akihiko Sugiyama, Hiroaki Ishiguro
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Patent number: 9821388Abstract: A horizontal band saw machine includes a base, a vertically-movable housing disposed above the base, a pair of wheels that are disposed at a lower portion of the housing and a distance between whose axis lines is changeable, a band saw blade lopped over the pair of wheels, and saw blade guides that are provided on the base. An installation position of the band saw blade is set lower than a cutting end position of a workpiece to be cut by the band saw blade. The housing can move the pair of wheels to the installation position. The pair of wheels can be inserted into an region surrounded by the band saw blade that is set on the saw blade guides when being moved to the installation position with the distance shortened.Type: GrantFiled: February 7, 2014Date of Patent: November 21, 2017Assignees: AMADA HOLDINGS CO., LTD., AMADA MACHINE TOOLS CO., LTD.Inventors: Akio Seto, Masataka Kitai
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Patent number: 9823422Abstract: An optical delivery waveguide for a material laser processing system includes a small lens at an output end of the delivery waveguide, transforming laser beam divergence inside the waveguide into a spot size after the lens. By varying the input convergence angle and/or launch angle of the laser beam launched into the waveguide, the output spot size can be continuously varied, thus enabling a continuous and real-time laser spot size adjustment on the workpiece, without having to replace the delivery waveguide or a process head. A divergence of the laser beam can also be adjusted dynamically and in concert with the spot size.Type: GrantFiled: December 30, 2015Date of Patent: November 21, 2017Assignees: LUMENTUM OPERATIONS LLC, AMADA HOLDINGS CO. LTDInventors: Martin H. Muendel, Dahv Kliner
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Publication number: 20170326608Abstract: A press brake system that utilizes a punch holder adapted to be used with punch chips of various radii to achieve the desired bend on a part. The system maintains a common shut height enabling the press brake operator to be able to put different radius tip punches next to each other in a single press brake tooling setup.Type: ApplicationFiled: February 25, 2016Publication date: November 16, 2017Applicant: Amada America, Inc.Inventors: Scott Bowerman, Brian Rojas, Hidekatsu Kawasaki, Mamoru Sugimoto