Abstract: A package assembly includes a substrate, a chip located on the substrate, solder balls, pads, an encapsulation and separating posts corresponding to the pads one by one. The chip is electrically connected to the pads via the solder balls, and is encapsulated by the encapsulation. The separating posts extend from the edge of the corresponding pads in a direction away from the pads. The solder balls are accommodated in the separating posts to avoid a short connection between any two adjacent solder balls. A method of manufacturing the package assembly is also provided.

Abstract: A package structure includes a printed circuit board (PCB), a duplexer, a first dam, a second dam and a cover. The duplexer includes a transmission filter and a reception filter and is electrically connected with the PCB. The first dam is located on a surface of the PCB, and in cooperation with the PCB forms a first receptacle receiving the transmission filter. The second dam is located on the surface of the PCB, and in cooperation with the PCB forms a second receptacle receiving the reception filter. The cover is fixed with top parts of the first dam and the second dam to seal the transmission filter and the reception filter. A method of manufacturing plural such package structures is also provided.

Abstract: An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height relative to the base are formed on the outer surface of the base. The solder pads having a second height relative to the base are formed on the same surface having the signal traces. The first height of the signal trace is greater than the second height of the solder pad. Exemplary methods for manufacturing the printed circuit board are also provided.

Abstract: A concentrating photovoltaic chip assembly includes an upper lead frame, a lower lead frame for supporting electronic components, a photovoltaic chip for converting solar energy into electric energy, and a protective diode for protecting the photovoltaic chip from short-circuiting. A light inlet window is defined in the upper lead frame. Each of the photovoltaic chip and the protective diode is mounted between the upper lead frame and the lower lead frame and are electrically connect to the upper lead frame and the lower lead frame. The photovoltaic chip faces the light inlet window. A method for manufacturing the concentrating photovoltaic chip assembly is also provided.

Abstract: A thick-film hybrid circuit structure includes a first thick-film substrate, a second thick-film substrate stacked on the first thick-film substrate and electrically connected to the first thick-film substrate, a chip and an encapsulation body. The second thick-film substrate defines a receiving area, and the chip is fixed in the receiving area and electrically connected to the first thick-film substrate.

Abstract: A fabrication method of manufacturing a package a plurality of electronic components in an encapsulation body, firstly, mounting the plurality of electronic components and one ends of a plurality of metal resilient units on a substrate. After that, the plurality of electronic components and the plurality of metal resilient units are encapsulated on the substrate to form an encapsulation body with another ends of the plurality of metal resilient units exposed on an exterior surface of the encapsulation body. Then etching remaining epoxy resin on the other ends of the plurality of metal resilient units.

Abstract: A package assembly includes a substrate, an electronic component, and an encapsulation body. The electronic component is located on the substrate and electrically connected to the substrate. The encapsulation body encapsulates the electronic component with the substrate. A portion of the substrate corresponding to the electronic component defines a plurality of through holes. A diameter of each of the plurality of through holes gradually reduces from a top surface of the substrate toward a bottom surface of the substrate. The plurality of through holes prevent melting remnants of the encapsulation body from flowing outside of the substrate.

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract: A semiconductor chip package includes a substrate unit, a chip, metal members, a molding compound and a shielding layer. The chip is assembled on and electrically connected with the substrate unit. The substrate unit includes conductive seat portions surrounding the chip, and defines through holes respectively coated by conducting films to ground the corresponding seat portions. The metal members are assembled on the seat portions, surround the chip, and are grounded through the conducting films. The molding compound encapsulates the chip and the metal members, with part of each metal member exposed out of the molding compound. The shielding layer covers the molding compound and the parts of each metal member exposed out of the molding compound to shield the chip from electromagnetic radiation.

Abstract: A semiconductor package includes a lead frame, a first chip, a second chip, a plurality of bonding wires and a mold compound. The lead frame includes a pad portion at a center of the frame and a plurality of lead portions. The pad portion and the plurality of lead portions collectively define a receiving portion. The first chip is securely received in the receiving portion. The second chip is mechanically attached to the first chip. The plurality of bonding wires electrically connect the second chip to the plurality of lead portions. The mold compound encapsulates the lead frame, the first chip, the second chip and the plurality of bonding wires to form the semiconductor package.

Abstract: A method of manufacturing a lead frame includes, firstly, forming a metal plate which has a frame portion, a pad portion for mounting semiconductor elements, and lead portions. After that, the lead portions are etched to form a support end, a connecting terminal and a jointing end of each lead portion. Then a receiving portion for receiving the semiconductor elements is formed, wherein the receiving portion is collectively defined by the connecting terminals, the support ends and the pad portion. After that, step portions are formed on the lead portions and the pad portion by half-etching. A method of manufacturing a semiconductor package which includes the lead frame is also provided.

Abstract: A semiconductor chip package includes a substrate unit, a chip, metal members, a molding compound and a shielding layer. The chip is assembled on and electrically connected with the substrate unit. The substrate unit includes conductive seat portions surrounding the chip, and defines through holes respectively coated by conducting films to ground the corresponding seat portions. The metal members are assembled on the seat portions, surround the chip, and are grounded through the conducting films. The molding compound encapsulates the chip and the metal members, with part of each metal member exposed out of the molding compound. The shielding layer covers the molding compound and the parts of each metal member exposed out of the molding compound to shield the chip from electromagnetic radiation.

Abstract: A molding device for a semiconductor chip package includes a first molding die, a second molding die opposite to the first molding die and a plurality of pistons. The second molding die defines a plurality of cylinders for receiving the corresponding pistons. The first molding die and the second molding die collectively form a molding cavity to accommodate a substrate. The first molding die includes a protruding portion defining a groove opening towards the second molding die. The protruding portion and the second molding die collectively form an entrance and an exit on two sides of the groove. Each of the plurality of pistons is compressed to force a molding compound flowing through the entrance, the groove and the exit to fill into the molding cavity so as to encapsulate the substrate.

Abstract: A multi-layer ceramic electronic component includes a ceramic base, a pair of exterior electrodes located on two ends of the ceramic base, respectively, an inner electrode embedded in the ceramic base, and a solder blocking layer located between the pair of the exterior electrodes and projecting from an exterior surface of the ceramic base.

Abstract: An exemplary electronic package structure includes a substrate configured with a solder pad, a metal support element, an electronic component connected to the solder pad, and an encapsulation body. The metal support element is located between the solder pad and the electronic component. As a result, a gap is defined between the substrate and the electronic component. A height of the gap is equal to a height of the solder pad plus a height of the metal support element. The encapsulation body encapsulates the electronic component together with the substrate and the gap is completely filled with material of the encapsulation body.

Abstract: A LED package structure includes a substrate, a LED chip and a colloid. The substrate includes a first surface and a second surface. An opening is shaped from the first surface toward the second surface. A phosphor layer is coated on the bottom surface with two opposite parts of the bottom surface respectively neighboring to two opposite side walls of the opening exposed. A metal layer is coated on the two exposed opposite parts of the bottom surface, the two opposite side walls and the first surface. The LED chip is received in the opening and configured on the phosphor layer. The LED chip includes a pair of conductive pads electrically connecting to the metal layer. The colloid is filled between the LED chip and the metal layer to attach the substrate to the LED chip.

Abstract: An optical transceiver includes a substrate, a plurality of laser components, a bracket and a plurality of lenses. The substrate defines a plurality of through holes, a plurality of receiving grooves and at least two fixing holes. The laser components are received in the plurality of receiving grooves and installed on the substrate. The bracket includes a top cover with an upper surface and one or more side walls. The one or more sidewalls include at least two positioning posts and one or more fixing surfaces. The positioning posts are engaged with the fixing holes to position the bracket to the substrate. The fixing surfaces are affixed on the substrate by an adhesive. The one or more sidewalls define one or more through channels extending from the one or more fixing surface to the upper surface. The lenses are installed on the bracket and correspond to the laser components.

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract: A package structure comprising a first substrate, a second substrate, an encapsulation layer sandwiched between the first and second substrates, and at least one electronic component mounted on the first substrate and isolated from the second substrate by the encapsulation layer. At least one conducting hole is defined in the encapsulation layer to communicate the at least one electronic component with the second substrate. An inner wall of each of the at least one conducting hole is coated with a first metal layer to electrically connect the at least one electronic component to the second substrate.

Abstract: A LED package structure includes a substrate, a LED chip and a colloid. The substrate includes a first surface and a second surface. An opening is shaped from the first surface toward the second surface. A phosphor layer is coated on the bottom surface with two opposite parts of the bottom surface respectively neighboring to two opposite side walls of the opening exposed. A metal layer is coated on the two exposed opposite parts of the bottom surface, the two opposite side walls and the first surface. The LED chip is received in the opening and configured on the phosphor layer. The LED chip includes a pair of conductive pads electrically connecting to the metal layer. The colloid is filled between the LED chip and the metal layer to attach the substrate to the LED chip.