Abstract: A system, apparatus, and method for cooling multiple electronics components that includes a plurality of heat spreaders where each heat spreader includes a first plate and a second plate. The first plate has a first body portion configured to form a thermal transfer relationship with a first side of a first electronic component. The second plate has a second body portion configured to form a thermal transfer relationship with a second side of the first electronic component. The heat spreader has an extending member extending to and overlapping with a portion of a cold plate arranged to cool a second electronics component.

Abstract: A method and system for multidirectional installation and removal of electronics trays comprising electronic components into and from electronics racks. The electronics trays include one or more attachment mechanisms at each end of the electronics tray for securing the electronics tray in the electronics rack and permit multi-directional installation and removal of the electronics tray from the electronics rack. The attachment mechanism at each end of the electronics tray includes two engagement members biased to an extended position that are moveable to a retracted position to facilitate and permit movement of the electronics tray in the electronics rack.

Abstract: A server includes a master fan configured to generate airflow through the server and a slave fan disposed proximate a heat-generating component in the server. An operation of the slave fan is controlled, based on an operation of the master fan, by a slave fan controller communicatively coupled with the master fan and the slave fan.

Abstract: A system including at least a server, a bus bar, a power shelf and a power regulator. The power shelf can be configured to provide a direct current (DC) power to the server via the bus bar. The power regulator can be configured to receive a load signal from the power shelf, where the load signal can represent a load status of the power shelf. The power regulator can be further configured to, based on the load signal, regulate power between a battery and the bus bar to control a slew rate of the DC power on the bus bar, where the battery can be a part of the power regulator.

Abstract: A computing device includes a plurality of rear inlet disconnects extend from the rear side of the housing. The rear inlet disconnects are operable to be fluidly coupled with a rack manifold and receive fluid from the rack manifold. The rear inlet disconnects include a rear-to-front disconnect and a rear-to-cooling disconnect. A front inlet manifold is coupled with the housing and includes at least one front inlet disconnect operable to be fluidly coupled with one or more inlet cooling disconnects extending from the front side of the housing. The inlet cooling disconnects are operable to be fluidly connected with the liquid cooling system. An inlet transmission tube is coupled with an outside surface of the housing. The inlet transmission tube in fluid communication with the rear-to-front disconnect and operable to direct the fluid from the rear-to-front disconnect to the front inlet manifold.

Abstract: A fluid reservoir device is provided. A body forms a reservoir operable to receive fluid. The body is operable to transition between a contracted configuration and an expanded configuration such that the body in the expanded configuration expands a volume of the reservoir. A transition component is operable to transition the body between (1) the expanded configuration to the contracted configuration as a computing device fluidly connects with a rack manifold, and (2) the contracted configuration to the expanded configuration as the computing device disconnects from the rack manifold.

Abstract: An apparatus is provided for cooling a first heat source surrounded by a plurality of second heat sources in which a second heat sink for the plurality of heat sources is attached to a first heat sink connected to the first heat source. The apparatus avoids requiring dedicated mounts on the device for the second heat sink by employing the first heat sink to effectively sandwich the second heat sink against the plurality of heat sources. Embodiments further enhance the heat transfer by distributing heat pipes within fins of the first heat sink and by facing two sides of the first heat sink to create a duct through which airflow is channeled.

Abstract: The finned cold plate includes a plurality of fins forming a plurality of fin channels. The finned cold plate also includes at least one inlet port and at least one outlet port. The finned cold plate further includes an inlet duct system configured to receive fluid via the at least one inlet port and introduce the fluid into the fin channels at a plurality of inlet locations along the fin channels. The finned cold plate also includes an outlet duct system configured to gather fluid from a plurality of outlet locations along the fin channels and provide the fluid from the outlet locations to the at least one outlet port. In this way, overall heat-transfer may be improved while also minimizing heat-flux gradients.

Abstract: Embodiments described within disclose a floating interconnect in which two connectors on a carrier float a small amount in the direction of connection. Cam handles on the carrier provide leverage that overcomes an initial mating force and lever the carrier connections most or all of the way to full seat against the mating board connectors. Then, for each connector, a thumb screw passes through the connector and is screwed into the mating connector. As the thumbscrew is fastened, a shoulder on the thumbscrew draws the connected down and fully seats it against the board connector with move of the carrier connector being accommodated by the float of the connector with respect to the carrier. This reduces or prevents the compressive stress on the carrier that would otherwise result from having the connections made solely by forcing the carrier against the mating connectors.

Abstract: A fluid cleaning apparatus is provided for a computing system. The fluid cleaning apparatus includes a body forming a reservoir in fluid communication with a liquid cooling system. The reservoir is operable to receive fluid from the liquid cooling system. A cleaning unit is operable to reduce bacterial growth in the fluid received in the reservoir. A return component is in fluid communication with the reservoir and the liquid cooling system such that the fluid in the reservoir flows back into the liquid cooling system.

Abstract: A system and apparatus are provided for containing leakage in a cooling system, thereby preventing the leakage from contacting sensitive electronic devices. A containment tray is configured to cover the surface of one or more cold plates and the electronic devices beneath. The containment tray includes an access port in the base of the containment tray for each cold plate. Hydraulic fitting connections on each cold plate pass up through the access ports and are connected to a coolant supply system. The containment tray is clamped to the cold plates with the gaskets creating a seal between the cold plate and the containment tray. Thus, the containment tray is positioned to collect leakage from the coolant supply system connected to the cold plates above the electronic devices.

Abstract: A manifold system is provided. A secondary manifold is operable to be fluidly coupled with a liquid cooling system for each of a plurality of computing devices. The secondary manifold is configured to be positioned above the plurality of computing devices. A containment tray is disposed between the secondary manifold and the computing devices. The containment tray is operable to receive fluid that leaks from the secondary manifold.

Abstract: A reinforcement structure is provided for reinforcing a thumbscrew that fastens a printed circuit board (PCB) assembly to a metal carrier. The reinforcement structure may include a cap configured to engage with the thumbscrew. The cap may include a hollow cylindrical body having an outer sidewall and outer gears on the outer sidewall. The reinforcement structure may also include a base configured to attach to the PCB assembly. The base may include a planar plate having two or more outer edges and an inner hole. The base may also include an inner sidewall extending from the inner hole downward perpendicularly from the planar plate. The base may also include internal gears on an upper portion of the inner sidewall. The outer gears of the cap are coupled to the internal gears of the base to transfer the torque from the thumbscrew to the cap and to the base and then to nearby PCB components.

Abstract: A gantry is disclosed that mounts on rails within a server rack. The gantry provides for the stable and repeatable placement of a measurement probe that is oriented to determine the sag of a server by measuring the distances along the Z-axis from the probe to a server at different locations in a XY plane defined by the gantry.

Abstract: A transceiver protection device includes a body operable to be coupled with a cable. The cable is operable to be coupled, via a connector of the cable, to a transceiver. A detach component is operable to receive a detach force to detach the cable from the transceiver. The detach component extends from the body such that the detach component is adjacent to the transceiver when the cable is coupled with the transceiver. A catch component extends from the body. The catch component is operable to be received in an aperture formed by a hanger of the transceiver.

Abstract: The integrated circuit includes a mounting portion configured to attach at least a portion of the integrated circuit to a manifold of a liquid-cooled server. The integrated circuit also includes a temperature sensor configured to detect a temperature of the manifold. The integrated circuit also includes a leak detection sensor configured to detect whether a liquid exists in an area proximate the manifold. The integrated circuit also includes a communication system configured to communicate the temperature of the manifold and/or whether the liquid exists in the area. The integrated circuit is a compact solution usable to determine information (e.g., inlet temperature, outlet temperature, differential temperatures, leaks, etc.) about a server in which it is implemented.

Abstract: A power supply unit (PSU) exhaust duct includes a plurality of duct walls configured to, when attached to a server, form an enclosed space in communication with a PSU exhaust port of a PSU of the server and an interior space of the server that is outside of the PSU. The PSU exhaust port may be disposed at a rear wall of the server, and the PSU exhaust duct may be attached to a rear wall of the server. By connecting the PSU exhaust port to the interior space of the server, PSU fans of the PSU become in series with server fans of the server (e.g., main cooling fans of the server). Doing so may increase an amount of cool air flowing through the PSU compared to conventional means where the PSU fans and the server fans are in parallel.

Abstract: The self-centering floating fluid coupler includes a body having a first port and one or more second ports in communication with the first port. The fluid coupler also includes a housing assembly surrounding the body. The housing assembly includes a first opening exposing the first port of the body and a second opening exposing the one or more second ports of the body. The fluid coupler further includes one or more bias members disposed within the housing and configured to bias the body to a central position within the housing assembly. The body is able to move within the housing assembly to accommodate misalignments between the first port and a corresponding connection location (e.g., a mating fitting). Furthermore, the body is biased back to the central position when connections are removed. Accordingly, the fluid coupler allows for a broad range of misalignments.

Abstract: A tray system for capturing a liquid that leaks from a liquid connector assembly of a liquid coolant system for an electronic assembly, the tray system including: a tray section including a floor and one or more tray walls, the floor configured to extend underneath one or more components of the liquid connector assembly; and an engagement section coupled with the tray section and including one or more engagement portions configured to position the tray section beneath the one or more components of the liquid connector assembly to capture the liquid.