Patents Assigned to AMD Design, LLC
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Patent number: 12787766Abstract: A heat sink is provided that includes a plurality of heat sinks and a plurality of fins in a stacked configuration. The heat pipes are operable to receive and transfer heat away from a computing component. The fins form a central aperture extending along a vertical axis. At least one of the heat pipes includes a handle portion operable to extend across the central aperture to be grasped by a user.Type: GrantFiled: January 18, 2024Date of Patent: November 3, 2026Assignee: AMD DESIGN, LLCInventors: Sruti Chigullapalli, Atharva Rahane, Nicholas Keator, David Liang
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Publication number: 20260333615Abstract: A centrifugal fan system for exhausting air from a server is described herein. The centrifugal fan system includes a centrifugal fan assembly and a housing. The housing at least partially surrounds the centrifugal fan assembly, forms a fan air duct in airflow communication with the centrifugal fan assembly and forms an air outlet duct. The air outflow duct is in airflow communication with the fan air duct and includes an air exhaust outlet that is configured to exhaust air from the centrifugal fan system. The air outflow duct is configured such that airflow from the fan air duct to the air exhaust outlet is non-linear.Type: ApplicationFiled: April 21, 2025Publication date: October 22, 2026Applicant: AMD Design, LLCInventor: Darrin Troy VALLIS
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Publication number: 20260328860Abstract: Systems and devices for power delivery and thermal verifications are described. A device can include a step-up converter configured to receive a setpoint input that indicates a desired amount of power to draw from a power source, draw direct current (DC) power from the power source according to the setpoint input, and step up a voltage of the DC power to generate an output voltage. The device can further include at least one lossy inductor connected to an input terminal of the step-up converter. The at least one lossy inductor can be configured to convert an input current of the DC power being drawn into a first amount of heat. The device can further include a pulse load connected to an output terminal of the step-up converter. The pulse load can be configured to convert a current of the output voltage into a second amount of heat.Type: ApplicationFiled: April 18, 2025Publication date: October 22, 2026Applicant: AMD Design, LLCInventor: Aurelio Rodriguez ECHEVARRIA
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Publication number: 20260333625Abstract: A method and system to contain liquid coolant leaks in a rack that includes an electronics tray having a plurality of electronics components mounted on a mounting board, the electronics tray including a liquid coolant system having a liquid coolant for cooling the electronics components, wherein the electronics tray is moveable, preferably rotatable, between an operational position where the mounting board is located above the electronics components and a servicing position where the mounting board is located below the electronics components. In the operational position the electronics tray is configured so that any leaks of the liquid coolant from the liquid coolant system flow away from the mounting board by the influence of gravity. The system and method further including positioning a leak container below the electronics tray for collecting any liquid coolant in response to a leak of the liquid coolant.Type: ApplicationFiled: April 21, 2025Publication date: October 22, 2026Applicant: AMD Design, LLCInventors: Chen AN, Rukang HUANG, Mahesh Kumar VARREY
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Patent number: 12772410Abstract: System and method for providing reversible path for air to flow through a server chassis. The chassis having a moveable barrier extending vertically in a first airflow channel between first and second horizontal surfaces when closed, a second air airflow channel between the second and third horizontal surfaces and a moveable barrier extending vertically in a third airflow channel between the third and fourth horizontal surfaces when closed. The chassis also includes a movable barrier in a front-end frame connecting the first and third horizontal surfaces a movable barrier in a rear-end frame connecting the second and fourth horizontal surfaces. The third horizontal surface supports a circuit board having a plurality of electronic devices connected thereto, at least one fan and a controller for controlling a direction of airflow generated by the at least one fan.Type: GrantFiled: April 4, 2024Date of Patent: October 20, 2026Assignee: AMD Design, LLCInventors: Ting Yu Lin, Haiyan Luo
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Publication number: 20260304688Abstract: A system, apparatus, and method for cooling multiple electronics components that includes a plurality of heat spreaders where each heat spreader includes a first plate and a second plate. The first plate has a first body portion configured to form a thermal transfer relationship with a first side of a first electronic component. The second plate has a second body portion configured to form a thermal transfer relationship with a second side of the first electronic component. The heat spreader has an extending member extending to and overlapping with a portion of a cold plate arranged to cool a second electronics component.Type: ApplicationFiled: March 31, 2025Publication date: October 1, 2026Applicant: AMD Design, LLCInventors: Pruthvik RAGHUPATHI, Sunilkumar PINNU, Sruti CHIGULLAPALLI
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Publication number: 20260304673Abstract: A method and system for multidirectional installation and removal of electronics trays comprising electronic components into and from electronics racks. The electronics trays include one or more attachment mechanisms at each end of the electronics tray for securing the electronics tray in the electronics rack and permit multi-directional installation and removal of the electronics tray from the electronics rack. The attachment mechanism at each end of the electronics tray includes two engagement members biased to an extended position that are moveable to a retracted position to facilitate and permit movement of the electronics tray in the electronics rack.Type: ApplicationFiled: March 27, 2025Publication date: October 1, 2026Applicant: AMD Design, LLCInventors: Chen AN, Yuan ZHANG
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Publication number: 20260304685Abstract: A server includes a master fan configured to generate airflow through the server and a slave fan disposed proximate a heat-generating component in the server. An operation of the slave fan is controlled, based on an operation of the master fan, by a slave fan controller communicatively coupled with the master fan and the slave fan.Type: ApplicationFiled: March 27, 2025Publication date: October 1, 2026Applicant: AMD Design, LLCInventors: TingYu Tony LIN, Felix Fang Ning LIU, Chaunke LIN
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Publication number: 20260302821Abstract: A system including at least a server, a bus bar, a power shelf and a power regulator. The power shelf can be configured to provide a direct current (DC) power to the server via the bus bar. The power regulator can be configured to receive a load signal from the power shelf, where the load signal can represent a load status of the power shelf. The power regulator can be further configured to, based on the load signal, regulate power between a battery and the bus bar to control a slew rate of the DC power on the bus bar, where the battery can be a part of the power regulator.Type: ApplicationFiled: March 31, 2025Publication date: October 1, 2026Applicant: AMD Design, LLCInventor: Brian GRIFFITH
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Patent number: 12745373Abstract: A computing device includes a plurality of rear inlet disconnects extend from the rear side of the housing. The rear inlet disconnects are operable to be fluidly coupled with a rack manifold and receive fluid from the rack manifold. The rear inlet disconnects include a rear-to-front disconnect and a rear-to-cooling disconnect. A front inlet manifold is coupled with the housing and includes at least one front inlet disconnect operable to be fluidly coupled with one or more inlet cooling disconnects extending from the front side of the housing. The inlet cooling disconnects are operable to be fluidly connected with the liquid cooling system. An inlet transmission tube is coupled with an outside surface of the housing. The inlet transmission tube in fluid communication with the rear-to-front disconnect and operable to direct the fluid from the rear-to-front disconnect to the front inlet manifold.Type: GrantFiled: February 26, 2024Date of Patent: September 22, 2026Assignee: AMD DESIGN, LLCInventors: Sruti Chigullapalli, Paul Anderson, Frank Russo
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Patent number: 12720707Abstract: A fluid reservoir device is provided. A body forms a reservoir operable to receive fluid. The body is operable to transition between a contracted configuration and an expanded configuration such that the body in the expanded configuration expands a volume of the reservoir. A transition component is operable to transition the body between (1) the expanded configuration to the contracted configuration as a computing device fluidly connects with a rack manifold, and (2) the contracted configuration to the expanded configuration as the computing device disconnects from the rack manifold.Type: GrantFiled: November 21, 2023Date of Patent: August 25, 2026Assignee: AMD DESIGN, LLCInventors: Mahesh Varrey, Chen An
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Patent number: 12720713Abstract: An apparatus is provided for cooling a first heat source surrounded by a plurality of second heat sources in which a second heat sink for the plurality of heat sources is attached to a first heat sink connected to the first heat source. The apparatus avoids requiring dedicated mounts on the device for the second heat sink by employing the first heat sink to effectively sandwich the second heat sink against the plurality of heat sources. Embodiments further enhance the heat transfer by distributing heat pipes within fins of the first heat sink and by facing two sides of the first heat sink to create a duct through which airflow is channeled.Type: GrantFiled: December 21, 2022Date of Patent: August 25, 2026Assignee: AMD Design, LLCInventors: Sruti Chigullapalli, Sunilkumar Pinnu, Wojciech Marcin Serafin, Cong Yao
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Publication number: 20260247567Abstract: The finned cold plate includes a plurality of fins forming a plurality of fin channels. The finned cold plate also includes at least one inlet port and at least one outlet port. The finned cold plate further includes an inlet duct system configured to receive fluid via the at least one inlet port and introduce the fluid into the fin channels at a plurality of inlet locations along the fin channels. The finned cold plate also includes an outlet duct system configured to gather fluid from a plurality of outlet locations along the fin channels and provide the fluid from the outlet locations to the at least one outlet port. In this way, overall heat-transfer may be improved while also minimizing heat-flux gradients.Type: ApplicationFiled: February 13, 2026Publication date: August 20, 2026Applicant: AMD Design, LLCInventors: Ting-Yu LIN, Atharva Manoj RAHANE
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Patent number: 12706416Abstract: Embodiments described within disclose a floating interconnect in which two connectors on a carrier float a small amount in the direction of connection. Cam handles on the carrier provide leverage that overcomes an initial mating force and lever the carrier connections most or all of the way to full seat against the mating board connectors. Then, for each connector, a thumb screw passes through the connector and is screwed into the mating connector. As the thumbscrew is fastened, a shoulder on the thumbscrew draws the connected down and fully seats it against the board connector with move of the carrier connector being accommodated by the float of the connector with respect to the carrier. This reduces or prevents the compressive stress on the carrier that would otherwise result from having the connections made solely by forcing the carrier against the mating connectors.Type: GrantFiled: November 21, 2022Date of Patent: August 11, 2026Assignee: AMD Design, LLCInventors: Mahesh Kumar Varrey, Chen An
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Patent number: 12699427Abstract: A fluid cleaning apparatus is provided for a computing system. The fluid cleaning apparatus includes a body forming a reservoir in fluid communication with a liquid cooling system. The reservoir is operable to receive fluid from the liquid cooling system. A cleaning unit is operable to reduce bacterial growth in the fluid received in the reservoir. A return component is in fluid communication with the reservoir and the liquid cooling system such that the fluid in the reservoir flows back into the liquid cooling system.Type: GrantFiled: September 28, 2023Date of Patent: August 4, 2026Assignee: AMD Design, LLCInventors: Sruti Chigullapalli, Chen An, Pruthvik Raghupathi, Peter Cloney
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Publication number: 20260223325Abstract: A system and apparatus are provided for containing leakage in a cooling system, thereby preventing the leakage from contacting sensitive electronic devices. A containment tray is configured to cover the surface of one or more cold plates and the electronic devices beneath. The containment tray includes an access port in the base of the containment tray for each cold plate. Hydraulic fitting connections on each cold plate pass up through the access ports and are connected to a coolant supply system. The containment tray is clamped to the cold plates with the gaskets creating a seal between the cold plate and the containment tray. Thus, the containment tray is positioned to collect leakage from the coolant supply system connected to the cold plates above the electronic devices.Type: ApplicationFiled: March 25, 2026Publication date: July 30, 2026Applicant: AMD Design, LLCInventors: Chen An, Mahesh Kumar Varrey, Oghenerukevwe Ayanruoh, Sruti Chigullapalli
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Patent number: 12690165Abstract: A manifold system is provided. A secondary manifold is operable to be fluidly coupled with a liquid cooling system for each of a plurality of computing devices. The secondary manifold is configured to be positioned above the plurality of computing devices. A containment tray is disposed between the secondary manifold and the computing devices. The containment tray is operable to receive fluid that leaks from the secondary manifold.Type: GrantFiled: January 12, 2024Date of Patent: July 21, 2026Assignee: AMD DESIGN, LLCInventors: Robert Hastings, Sruti Chigullapalli, Shubham Sinha, Chen An
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Patent number: 12690134Abstract: A reinforcement structure is provided for reinforcing a thumbscrew that fastens a printed circuit board (PCB) assembly to a metal carrier. The reinforcement structure may include a cap configured to engage with the thumbscrew. The cap may include a hollow cylindrical body having an outer sidewall and outer gears on the outer sidewall. The reinforcement structure may also include a base configured to attach to the PCB assembly. The base may include a planar plate having two or more outer edges and an inner hole. The base may also include an inner sidewall extending from the inner hole downward perpendicularly from the planar plate. The base may also include internal gears on an upper portion of the inner sidewall. The outer gears of the cap are coupled to the internal gears of the base to transfer the torque from the thumbscrew to the cap and to the base and then to nearby PCB components.Type: GrantFiled: February 9, 2022Date of Patent: July 21, 2026Assignee: AMD Design, LLCInventors: David Liang, Jeff Valerio
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Patent number: 12687382Abstract: A gantry is disclosed that mounts on rails within a server rack. The gantry provides for the stable and repeatable placement of a measurement probe that is oriented to determine the sag of a server by measuring the distances along the Z-axis from the probe to a server at different locations in a XY plane defined by the gantry.Type: GrantFiled: January 30, 2024Date of Patent: July 21, 2026Assignee: AMD Design, LLCInventors: JonCarlo DeFazio, Atticus Bowie, Peter Alex Lescaille
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Patent number: 12683641Abstract: A transceiver protection device includes a body operable to be coupled with a cable. The cable is operable to be coupled, via a connector of the cable, to a transceiver. A detach component is operable to receive a detach force to detach the cable from the transceiver. The detach component extends from the body such that the detach component is adjacent to the transceiver when the cable is coupled with the transceiver. A catch component extends from the body. The catch component is operable to be received in an aperture formed by a hanger of the transceiver.Type: GrantFiled: July 25, 2023Date of Patent: July 14, 2026Assignee: AMD Design, LLCInventors: Justin Widodo Purnamasidi, Jie Ren