Abstract: A cutter to cut die attach solder preform material is disclosed. It is formed of: a base; a pair of raised blocks spaced apart on the base with each having a slot sized to accommodate a cutting blade configured to cleave the material to be cut, constrain the cutting blade to vertical movement, and maintain the squareness of the cutting blade with respect to the base for cutting material; an adjustable stop positioned forward of the cutting blade which is configured to be moved so as to set the length of the material to be cut by the cutting blade; and a linear scale positioned proximate to the adjustable stop which enables a measured length of the material to be cut. Methods of using the aforementioned cutter are also disclosed.