Abstract: A hermetically sealed package embodying the invention includes a base member having top and bottom surfaces. An electronic device having multiple electrodes is securely mounted on the top surface of the base member. The electrodes of the electronic device are made accessible to external circuits via wire connection to conducting leads disposed through pre-formed holes extending vertically from the top surface to the bottom surface of the base member. The conductive leads then extend horizontally along preformed grooves formed along the bottom surface of the base member. The holes with the leads passing though them are hermetically sealed. A portion of selected conductive leads extending above the top surface are selectively bonded to selected electrodes of the electronic device. A ceramic cap is mounted over and around the electronic device and the conductive leads and encompasses them. The cap has a bottom rim which fits into a preformed trench running along the outer periphery of the base member.