Abstract: A thick film fuse assembly for high voltage, high amperage, high reliability applications. In a first embodiment the fuse assembly consists of an insulative substrate on which a parallel array of low mass thick film fusible elements are disposed. Thick film contact pads permit attachment of lead wires in electrical contact with the fusible elements. The fusible array is covered with a coating of arc suppressant glass. In a second embodiment of the fuse assembly, the fusible elements comprise thick film end portions and upstanding conductive wires which are positioned above and away from the insulative substrate. The arc suppressant glass surrounds each of the upstanding wires which permits higher amperage capacity.