Abstract: Methods of treating superconducting composites to enhance their wettability in solder, and composites having enhanced wettability. It has been found that wettability can be substantially enhanced by stripping a thin layer off the surface of the composite before incorporating it into a laminated component. This layer can be stripped, for example, by chemically etching the composite, for example in a solution of nitric acid and ammonium bifluoride.
Type:
Grant
Filed:
January 20, 2000
Date of Patent:
January 15, 2002
Assignee:
American Semiconductor Corp.
Inventors:
Craig J. Christopherson, David M. Olen, Deborah L. Ouellette, Thomas De Santos, Eric R. Podtburg, Sy-Jenq Loong