Abstract: The present invention provides method and apparatus for determining lead integrity of IC devices characterized by an inspection arrangement which comprises optical elements for back lighting the leads disposed on either side of a trackway for the travel of the IC device thereon. The optical elements are arranged in such a fashion as to simultaneously produce a sharp backlit silhouette image of the leads protruding from either or both sides of the IC device. In accordance with the invention, means are provided for continuously and automatically feeding IC devices through an inspection station in the apparatus where an illumination source through the optical elements directs an intense light beam so that a sharp silhouette or backlit outline of the leads on both sides of the IC device is simultaneously obtained. A single camera is disposed to face the opposing direction of the illumination and optics to receive the silhouette or backlit outline of the IC device leads, as well as the top surface of the device.

Abstract: In an apparatus for aligning pins of PGA devices in a predetermined array of parallel rows, a comb assembly includes a plurality of tines disposed in side-by-side spaced parallel array. Adjacent tines are spaced apart a distance greater than the maximum cross section of a pin of the PGA device and a slide mechanism actuates the PGA device through the comb assembly whereby the comb tines engage between the rows of pins in the PGA device and straighten the same by a combing action. The comb tines are oriented relative to the PGA device to engage the pins along substantially their entire length.

Abstract: In apparatus for disposing DIP leads in a predetermined and preselected condition of straightness and orientation, a trackway for operatively supporting and moving DIPs therealong from a loading station to a discharge station, a forming station positioned along the trackway subsequent to said entrance station. The forming station includes laterally spaced rotatable forming rollers on opposite sides of the trackway, anvils confronting the inner faces of the leads between the forming rollers and anvils. The rollers and anvil having cooperating confronting surfaces adapted to engage the DIP leads adjacent the shoulder to the outer terminal ends, the forming rollers cooperatively associated with the anvils and spaced therefrom to define a nip gap. DIPs are moved through the nip gap whereby DIP leads are contacted to align them in predetermined orientation and at a predetermined angle relative to the body portion.

Abstract: An apparatus for the transfer of DIP devices to or from DIP delivery tubes is shown to include a hopper for the storage of several tubes, an elevator member for removing individual tubes from the hopper and depositing such tubes into a hopper, an orienting member which positions the tube in a predetermined radial orientation and which moves the tube axially in response to a control signal to a head member which receives the radially oriented tube and guides it to a predetermined second orientation for the transfer of DIP devices and which ejects such tubes upon completion and a computer control member for generating the necessary actuation signals to coordinate the transfer of DIP devices and tube ejection. The head member may also be provided with an extracation member to remove any pin or plug which may seal the tube.

Abstract: A system for handling DIP devices packaged in elongated tubes having releasable closure means normally closing at least one end of the tubes to retain DIP devices therein, a head assembly for transferring tubes from an accumulator station to a DIP processing apparatus comprising a housing having an inlet and a discharge trackway section, a pair of drive rollers rotatably mounted adjacent the inlet end of the housing. The rollers are mounted for floating movement relative to one another in a direction generally transverse to the movement of tubes through the housing, closure removal and re-application mechanism downstream of the drive rollers, means for aligning the tube to ensure flow of DIP devices from the tube to the discharge trackway and tube position sensor means operable to activate mechanism for positioning the head assembly so that the discharge trackway section aligns with an inlet trackway of DIP processing apparatus.

Abstract: A switch track mechanism for selectively directing electronic components from a single trackway to one of a plurality of discharge or accumulator stations comprising a first fixed track sections adjacent the trackway, a second fixed track section adjacent to and downstream of the first fixed track section, movable first and second track members operatively associated with the first and second fixed track sections and each operable between first and second limit positions. The second movable track member has a plurality of track sectors disposed in an array, a plurality of accumulator stations downstream of the second track member corresponding in number to the number of track sectors, a cartridge for electronic components is mounted at each accumulator station. The movable track sections have actuatable between limit positions whereby electronic components may be directed from the single trackway to a select one of the accumulator stations.

Abstract: An apparatus for determining lead integrity of DIP devices, wherein the leads of the DIP devices extend from a track for supporting the DIP devices during passage through the apparatus. Included is a transmitter for the transmission of a signal, positioned so that the leads of the DIP devices traveling on the track intersect the transmitted signals and a receiver for receiving and converting a transmitted signal to an electrical signal, positioned so that as the leads of the DIP device intersect the transmitted signal, the receiver generates an electrical signal reflective of the intersection for determining the integrity of the leads based upon the electrical signal. The receiver includes receptors positioned on either side of the track such that each receptor receives the transmitted signal intersected by the leads as the DIP devices travel on the track.

Abstract: An apparatus for determining lead integrity of DIP devices, wherein the leads of the DIP devices extend from a track for supporting the DIP devices during passage through the apparatus. Included is a transmitting means for the transmission of a signal, positioned so that the leads of the DIP devices traveling on the track intersect the transmitted signals and a receiving means for receiving and converting a transmitted signal to an electrical signal, positioned so that as the leads of the DIP device intersect said transmitted signal, the receiving means generates an electrical signal reflective of the intersection for determining the integrity of the leads based upon the electrical signal. The receiving means includes receptors positioned on either side of the track such that each receptor receives the transmitted signal intersected by the leads as the DIP devices travel on the track.

Abstract: In apparatus for disposing DIP leads in a predetermined and preselected condition of straightness and orientation, a trackway for operatively supporting and moving DIPs therealong from a loading station to a discharge station, a forming station positioned along the trackway subsequent to said entrance station. The forming station includes laterally spaced rotatable forming rollers on opposite sides of the trackway, anvils confronting the inner faces of the leads between the forming rollers and anvils. The rollers and anvil having cooperating confronting surfaces adapted to engage the DIP leads adjacent the shoulder to the outer terminal ends, the forming rollers cooperatively associated with the anvils and spaced therefrom to define a nip gap. DIPs are moved through the nip gap whereby DIP leads are contacted to align them in predetermined orientation and at a predetermined angle relative to the body portion.

Abstract: Apparatus and method for automatically or manually controlling the apparatus for trimming or cutting leads of electric devices of the type having an elongated body portion, and a plurality of leads extending from the opposite side edges of the body portion, more specifically for trimming leads of dual-in-line-devices (DIP devices) of a type used in conjunction with printed circuit boards (PCBs), wherein component dimensions and materials vary, and adjustments are provided to accomodate for different width and length sizes and more particularly to permit trimming of lead lengths to appropriate length for coaction with various PCBs.

Abstract: Apparatus and method for automatically or manually controlling the apparatus for trimming or cutting leads of electronic devices of the type having an elongated body portion, and a plurality of leads extending from the opposite side edges of the body portion, more specifically for trimming leads of dual-in-line-devices (DIP devices) of a type used in conjunction with printed circuit boards (PCBs), wherein component dimensions and materials vary, and adjustments are provided to accommodate for different width and length sizes and more particularly to permit trimming of lead lengths to appropriate length for coaction with various PCBs.

Abstract: An electronic component lead straightening device and method for conditioning, or reconditioning, electronic devices having an elongated body portion of possible different sizes and materials, and a plurality of metal leads extending from opposite edges of the body portion. The leads, for appropriate use of the electronic component in a circuit, such as a printed circuit on a mounting board, requires their disposition at a preferred predetermined angle to the body, and in substantial parallel mutual relationship, one to another.