Patents Assigned to American Telephone and Telegrph Company, AT&T Bell Laboratories
  • Semiconductor devices having multi-level metal interconnects
    Patent number: 4832789
    Abstract: A self-assigned, self-planarized metallization scheme for multilevel interconnections using self-aligned windows in integrated circuits is described. Trenches are etched into a dielectric and then, using an etch stop layer on top of the dielectric to prevent unwanted etching of the dielectric, self-aligned windows which expose portions of the substrate are etched in the dielectric. Self-aligned windows can also be formed without a mask.
    Type: Grant
    Filed: April 8, 1988
    Date of Patent: May 23, 1989
    Assignee: American Telephone and Telegrph Company, AT&T Bell Laboratories
    Inventors: William T. Cochran, Agustin M. Garcia, Graham W. Hills, Jenn L. Yeh