Abstract: A speech recognizer system for use with a telecommunication network wherein an input signal generated onto the network from a first terminal is directed to a speech recognizer for estimating the verbal content of the input signal. The speech recognizer or associated equipment then directs an estimate of the verbal content as an output signal back to the first terminal, the estimate including one or more approximations of the verbal content of the input signal. At the first terminal the user then confirms a correct estimate, or selects from a plurality of approximations, the verbal content of the input signal.

Abstract: A method of fabricating an electronic device uses a micromachined tool that has openings which receive and align components with respect to each other and a substrate. The tool has fiducial marks which align to fiducial marks on the substrate, thereby producing precise alignment of the tool and the substrate. The components are then inserted into the openings, thereby insuring their alignment with respect to the substrate.

Abstract: A method of making a semiconductor integrated circuit package (20) containing a chip (25)--and/or other active or passive electronic component(s)--enclosed in an encapsulation layer (24) can be made thinner by abandoning the limitation of equality of thicknesses of electrically conductive lead frame fingers (21) and paddle (mounting pad, 22)--the latter of which supports the chip (25) during fabrication of the package prior to encapsulation. As a result, a desired downset d of the paddle (22) with respect to inner portions (21.1) of the conductive fingers (21) automatically occurs without any bending of any die paddle support fingers--the latter of which support the paddle during fabrication of the package. The paddle (22) advantageously is made by preparing a metallic pad sheet having a thickness equal to that of the paddle (22), and then dividing it into a multiplicity of pieces, each of the pieces having a contour such that the piece is suitable for use as the paddle (22).

Abstract: Disclosed is a means for testing drop wires in digital loop systems which employ optical fiber up to a distant terminal near the subscriber's premises. A test module is provided at the distant terminal to determine the presence or absence of faults on the wires to the customer premises. The results of the test are transmitted via an optical data link to the remote terminal where the results can be accessed by a loop tester at the central office.

Abstract: An alignment sleeve (66) for holding two conically shaped portions (30--30) of plugs (24--24) each of which terminates an optical fiber (25) includes two conically shaped cavities (68, 70) communicating through a common minimal diameter plane (72). After the sleeve has been molded, a tool (100) faced with an abrasive material is inserted into each cavity of the sleeve and turned rotatably while a force is applied in a direction parallel to the longitudinal axis of the tool. This causes material to be removed from the walls defining the cavities so that when the two plugs are inserted into the cavities, the axes of the fibers will be aligned coaxially and the end faces of the fibers will have a predetermined separation. The apparatus of this invention also may be used to adjust a length measurement of plugs. This is accomplished by inserting a plug into a conically shaped cavity of a tool.

Abstract: Photomasks (11, 12) are aligned on opposite sides of a wafer by directing light beams through zone plates (13 A-C) in one photomask and through aligned transparent slits (14 A-C) on the other photomask. Simulantaneous detection of the beams by photodetectors (18 A-C) indicates alignment. A method for obtaining precise centering by scanning the slits with the beams, sampling light transmitted through the slits, and fitting the samples to a parabola by the use of a computer (27) is also described.

Abstract: A computer controlled speakerphone includes a line adapting arrangement for developing information about an interface between the speakerphone and a hybrid in a communication line and for providing optimal performance during operation by adapting operating parameters of the speakerphone to the line. During a conversation, the line adapting arrangement measures and averages the degree of hybrid reflection that is presented to the speakerphone. This hybrid reflection provides a measure of both the hybrid and a far-end acoustic return. By determining the degree of hybrid reflection, the switching threshold level of the speakerphone for switching between the transmit state and the receive state may be adjusted. Once the expected level of receive speech due to hybrid reflection is known, additional receive speech due to the far-end talker may be accurately determined and the state of the speakerphone switched accordingly.

Abstract: A bonded optical fiber array (20) includes a parallel coplanar array of longitudinally extending contacting optical fibers (22--22). Each optical fiber is enclosed in inner and outer layers of coating materials and is provided with a color identifier. The inner layer is comprised of a UV curable bonding material having a modulus in the range of about 1 M Pa. For mechanical protection, the outer layer is a UV curable bonding material having a modulus in the range of about 1 GPa. When the optical fibers are disposed in the parallel array, interstices are created between the fibers and between the fibers and an envelope which is spaced no further than about 25 .mu.m at its closest point to each fiber. A UV curable matrix bonding material which has a modulus having a value less than that of the outer coating layer on the fiber and more than that of the inner coating layer fills the interstices, extends to the peripheral line which defines the envelope and bonds together the optical fibers.

Abstract: A method for producing, without etching, a perforated layer of epitaxial metal silicide, especially CoSi.sub.2, on a single crystal Si substrate, with epitaxial Si overlying the silicide layer. The layer thickness, and the number and size of the openings in the layer are such as to make the structure suitable as an electronic device, in particular, as a permeable base transistor. The number and/or size of the openings is a function of processing parameters such as the substrate orientation, the annealing temperature of the film, or the Co/Si ratio of the deposited material. A device comprising a perforated silicide layer is also disclosed.

Abstract: A buffer optical fiber (20) includes an optical fiber (21) comprising a core and a cladding. The optical fiber is enclosed by a plastic buffer layer (50). Interposed between the optical fiber and the buffer layer are a plurality of fibrous strands (25--25) which are strength members for the buffered optical fiber. In a preferred embodiment, the strength members are layless and as such are generally linear and parallel to a longitudinal axis of the buffered optical fiber. The buffer layer has a predetermined compressive engagement with the strength members which allows the stripability of the buffer layer from the fiber to be controlled.

Abstract: The longitudinal electro-optic effect is used with an external probe to make voltage measurements on electrical conductors.

Abstract: Semiconductor devices are described which are made by a process involving the use of certain types of glass layers. These glass layers have high silica content, small amounts of boron oxide and optionally small amounts of aluminum oxide. The glass layers are put down by e-beam deposition procedure using a glass target made from restructured glass. Commercial availability of such glass makes the procedure very convenient. Such glass layers are advantageously used as barrier layers in annealing procedures used when semiconductors are doped (e.g., ion implantation in semiconductors) and as encapsulating layers in finished devices.

Abstract: A vacuum pickup tool (11), capable of picking up components (26) having a wide range in size and weight, comprises a body (12) having shaft (14) extending therefrom. The end of the shaft furthest from the body has an orifice (18) surrounded by a sealing surface (22) adapted for contact with a planar surface (24) on the component to form a substantially airtight seal therewith. A sleeve (30), having a rim (32) at the end thereof, is slidably carried by the shaft for movement thereon between a first and second position. At the first position of the sleeve, the sealing surface (22) at the end of the shaft extends beyond the rim (32) so that the sealing surface may contact the component, enabling a vacuum to be drawn over a first sized vacuum area on the surface of the component when the vacuum is drawn through the orifice.

Abstract: A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.

Abstract: An integrated circuit includes first and second field effect transistors having differing channel lengths, and a means for comparing the channel currents flowing therethrough. An excessive difference of currents indicates "short channel" effects, which can degrade performance. A signal flag indicating this condition may be provided to a test pad on the chip, or used to disable operation of the integrated circuit, or otherwise used to provide an indication.

Abstract: A biconic connector (40) includes two plugs (44-44) each of which terminates a single fiber optical cable (55) and each of which includes a truncated conically shaped end portion (50). The connector also includes an alignment sleeve having back-to-back conically shaped cavities each of which is adapted to receive an end portion of a plug. In order to minimize loss through the connection, it becomes important for the centroid of the cross-sectional area of a light beam in the end face of the plug to be coincident with the axis of revolution of the conically shaped surface of plug. This is accomplished by holding the plug in a fixture such that its end portion is exposed and the fixture adapted to be turned about an axis of rotation. Images of a light beam launched into the optical fiber are acquired in a plane through the end face of the plug.

Abstract: An integrated transformer structure is disclosed. In one embodiment, the primary transformer winding is formed using dielectrically isolated (DI) technology so as to isolate high voltages applied to the transformer primary from other components in the substrate. Alternatively, conventional junction isolated technology may be used, where physical separation between the integrated transformer and other components may be provided. In accordance with the present invention, the primary winding comprises a planar spiral formed with a low-resistivity material and incorporated with the substrate. An insulating layer is then formed over the primary winding. A planar spiral configuration is also used to form the secondary winding, where the secondary may be formed of a deposited metal and is formed on top of the insulating layer so as to be directly above the primary winding. The result is an effective air-core transformer structure capable of isolating thousands of volts.

Abstract: An integrated photodetector-amplifier is described which is planar and exhibits excellent circuit characteristics including low input capacitance, high speed, and high sensitivity. Also, certain self-alignment features and a planar technology made fabrication of the circuits simpler and easier than most such circuits.

Abstract: The disclosed simple, economical and rapid sol-gel process for forming a silica-based glass body, termed the "vapogel" process, comprises introduction of a silicon halide-containing gas (e.g., SiCl.sub.4 +O.sub.2) into an aqueous medium. The thus formed sol can gel within minutes, resulting in a monolithic gel from which particles having a narrow size distribution can easily be formed. The thus formed particles can be used to produce a glass body such as an optical fiber. Various techniques for forming the glass body from the gel are disclosed. Among the many advantages of the vapogel method are its ability to produce very homogeneous mixed oxide glasses of composition not obtainable by prior art sol-gel processes, and the advantageous mechanical properties of the gel produced by the method. The latter makes possible, inter alia, formation of particles having a relatively narrow size distribution.

Abstract: Low-loss coupling between a local feed connection or node, and a multi-mode optical fiber bus is provided by reflective insertion of a relatively small number of modes into the bus fiber. Essentially all input power available at the node is thus inserted into the bus, while but a small portion of power is extracted from the bus.