Abstract: An electrical interconnect has a non-planar ceramic substrate with opposing first and second ends. A first conductive layer having first and second opposing sides is disposed within the ceramic substrate with one of the first and second opposing sides exposed at the first end and one of the first and second opposing sides exposed at the second end. The electrical interconnect is useful to join an integrated circuit in a hybrid package to a circuit board in high frequency communication applications.
Type:
Application
Filed:
July 3, 2014
Publication date:
January 7, 2016
Applicant:
AMETEK AEGIS
Inventors:
Kenneth G. McGillivray, Ricky Lee Sturdivant