Patents Assigned to AMG Intellifast GmbH
  • Patent number: 9063069
    Abstract: An ultrasound measurement system and a method for carrying out ultrasound measurements is provided that includes a data acquisition unit and a transducer for coupling an ultrasound pulse into a connecting element and for extracting an ultrasound pulse echo from the connecting element. The ultrasound measurement system proposed according to the invention comprises the data acquisition unit which has a combination of analog and digital electronics for excitation and driving of the transducer. This is separated from a data processing unit and is in contact therewith via a wired or wireless connection.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: June 23, 2015
    Assignee: AMG Intellifast GmbH
    Inventor: Manfred Stickel
  • Patent number: 8511175
    Abstract: A connection component is provided that includes an integrated ultrasound sensor, wherein the ultrasound sensor has a layer structure comprising at least two layers, with an electrode layer and at least one layer of a material having piezoelectric properties. The at least one electrode layer and the at least one layer of a material having piezoelectric properties are arranged on a freely accessible end of the connection component. Structures are formed in the electrode layer in order to produce electrodes by laser-ablated regions.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: August 20, 2013
    Assignee: AMG Intellifast GmbH
    Inventors: Gert Hoering, Jafar Zendehroud
  • Patent number: 8177464
    Abstract: The invention relates to a connector component (1) with integrated ultrasonic sensor (5). The ultrasonic sensor (5) is used to determine the prestressing force or the stressing force of the connector component (1), wherein the ultrasonic sensor (5) has a layer construction (20) having an electrode layer (21), at least one mechanical protection layer (22) and at least one layer (23) composed of a material having piezoelectric properties. The at least one electrode layer (21), the at least one mechanical protection layer (22) and the at least one layer (23) composed of a material having piezoelectric properties are arranged in a manner applied by sputtering at a freely accessible end (25, 27) of the connector component (1).
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: May 15, 2012
    Assignee: AMG Intellifast GmbH
    Inventors: Jafar Zendehroud, Gert Hoering