Abstract: A digitally controlled impedance driver circuit including a number of fingers, some of which having FETs and series resistors sized in binary or other differential ratios, and some of the higher power FETs being sized in equal ratio and perhaps sharing a series resistor. A DCI controller circuit periodically determines a configuration of the DCI driver circuit that would result in the DCI driver circuit approximating a target impedance. Each time the DCI controller circuit does this, a comparator determines if the impedance of the DCI driver circuit should be increased or decreased. A noise attenuation circuit turns off (or on) only one of the high power fingers if the controller circuit determines that more (or less) impedance is needed even if turning off (or on) only one of the fingers would not result in the configuration of the DCI driver circuit determined by the controller circuit.

Abstract: An integrated overvoltage and reverse voltage protection circuit. The protection circuit includes a field-effect transistor having a source terminal coupled to an input terminal of the protection circuit, and a drain terminal coupled to an output terminal of the protection circuit. A resistor is coupled between the source terminal and the body terminal of the field-effect transistor to inhibit reverse current flow during a reverse voltage condition. A voltage-current dependent circuit is coupled between the gate terminal and the source terminal of the field-effect transistor, and is configured to apply a voltage between the gate terminal and the source terminal that is dependent on the current passing through the voltage-current dependent circuit. A current application circuit is coupled to the voltage-current dependent circuit and is configured to apply a current that limits or even altogether stops an applied overvoltage condition from reaching a load circuit.

Abstract: Systems and methods are disclosed for distributing memory within one or more regions of circuitry that perform logic functions (or other types of functions that require dense interconnect structures) on an integrated circuit. The distributed memory reduces high density routing congestion, allows increased logic utilization, and provides areas for additional interconnect structure. Various techniques are also disclosed for accessing the memory.

Abstract: An integrated overvoltage and reverse voltage protection circuit that includes two p-channel double-sided extended drain transistors coupled to a high voltage source, each having their n-well coupled through a resistor to the high voltage source. For voltage regulation, a voltage divider is coupled in series with a first of these transistors, while the drain of the second transistor is coupled to the gate of the first transistor. For voltage blocking, the voltage divider may span the entire supply voltage. An n-channel transistor couples the second p-channel transistor to a low voltage source. A middle node in the voltage divider is coupled to one input of a comparator, with a reference voltage coupled to the second input. The comparator output drives the gate terminal of the n-channel transistor. A load to be protected may be disposed in parallel with the voltage divider.

Abstract: A dual differential-input operational amplifier that includes six PMOSFETs having their source terminals coupled to a high voltage. A seventh and eighth PMOSFET have their source terminals coupled to a current source. Four NMOSFETs have their source terminals coupled to a low voltage. A fifth and sixth NMOSFET have their source terminals coupled to a current sink. The various PMOSFETs and NMOSFETs are coupled together such that the gate terminals of the fifth NMOSFET and eighth PMOSFET receive a first input of the differential input, and such that the gate terminals of the sixth NMOSFET and the seventh PMOSFET receive a second input of the differential input. The operational amplifier may be vertically inverted, or implemented by bipolar transistors, with cascoding devices, and with a second stage in the form of an inverter.

Abstract: An electrostatic discharge (ESD) protection circuit for the protection of an electronic circuit from an ESD event. The electronic circuit, in operation, is provided with a supply voltage and a reference voltage (typically electrical ground) via voltage terminals and/or power supply buses. The protection circuit includes two bipolar transistors in series, where the transistors are coupled between the supply voltage terminal/bus and the reference voltage terminal/bus. The bases of the transistors are coupled via a connection including two resistors in series, where the connection point between the two resistors is coupled with the connection point between the two transistors.

Abstract: A method for making interconnect structures, particularly in a semiconductor integrated circuit, is described. The method comprises the steps of: forming a conductive layer; forming of an insulating layer above said conductive layer; creating a plurality of holes in said insulating layer and filling the holes with tungsten thereby forming tungsten plugs, such that said tungsten plugs are in electrical contact with the conductive layer. A patterned metallisation layer that overlies said insulating layer (is formed by means of following steps: forming a continuous metallisation layer, forming an organic mask, etching in plasma said continuous metallisation layer, removing the organic mask in a dry way, and immersing the obtained wafer including the layers (3, 4, 5) and the tungsten plugs in a cleaning solution to remove the post-etching residues. Before immersing into said cleaning solution, the wafer is submitted to a plasma treatment containing F, H or a mixture of F and H.

Abstract: A complementary differential amplifier includes two differential amplifiers. Each differential amplifier includes two input FETs (or bipolar transistors) having gate terminals coupled to the input terminals of the complementary differential amplifier. Two current load p-type field-effect transistors are each coupled in series between one voltage source and a drain terminal of a respective input FET. A current source FET is coupled in series between a common source terminal of the two input n-type field-effect transistors and a low voltage source. Only two FETs are needed to bias all of the current load and source FETs. A complementary folded cascode stage as well as an inverter stage may also be included.

Abstract: An oscillation circuit including a resonating element such as a crystal, an inverting amplifier and a resistor that each span the resonating element terminals, and two capacitors that capacitively couple the resonating element terminals to ground. An AC current source such as a temperature compensated and properly trimmed ring oscillator generates a differential AC current when active. The differential AC current has a frequency that is within a tolerance of the resonant frequency of the resonant element for a given set of operating conditions. Two buffers connect the differential outputs of the AC current source to respective terminals of the resonating element to thereby shorten startup time. A control logic circuit carefully times the application of the differential AC current to the resonating element terminals such that the current is applied for a sufficient time such that startup would occur under any anticipated operating condition.

Abstract: A switched capacitor voltage reference circuit that has a transconductance circuit that receives the output of the amplifier, and then outputs a current that depends on its input voltage. This may be accomplished using a charge pump that is controlled by the amplifier output. The transconductance circuit provides a reference voltage at the output terminal of the switched capacitor generation circuit. A capacitor capacitively couples the output terminal of the switched capacitor circuit to the inverting terminal of the amplifier during the generation phase. By adjusting the capacitances of the various capacitors, the level and temperature dependence of the generated reference voltage may be controlled. Also, the charge pump often allows for reference voltages that are greater than the supply voltage.

Abstract: An SRAM memory includes a pull-up device coupled to each row of word lines in an array of SRAM cells. The pull-up devices are sized such that when a row is selected, the time for the associated word line to fully charge is sufficiently slow such that data stored in the selected SRAM cells are not corrupted during a read operation. By slowly charging the word lines, the corresponding access transistors are also slowly turned on, resulting in the coupled bit lines slowly charging or discharging from the data stored in the SRAM cell. Because there is not a sudden large charge transfer between the stored data and the coupled bit line, the data will not be corrupted during a read operation, and read precharge circuitry is not required.

Abstract: A fabricated multiple layer integrated circuit in which adequate planarization is accomplished using irregularly shaped and properly spaced conductive filler features that are spaced in such a way that capacitive coupling of the conductive filler features with the active conductive regions is reduced. The overall layout area of the conductive filler features is reduced to thereby reduced capacitive coupling with active conductive above and below. In addition, a relatively small edge of the feature is closest to the active conductive in the same conductive layer thereby further reducing capacitive coupling.

Abstract: A programmable voltage reference circuit that includes a current-to-voltage converter circuit, a voltage-to-current converter circuit, and a floating gate. The current-to-voltage converter circuit has two current input terminals and a voltage output terminal. The voltage-to-current converter circuit has two voltage input terminals and two current output terminals. The two current output terminals are each coupled to a corresponding current input terminal of the current-to-voltage converter circuit. A floating gate device has one terminal coupled to a fixed voltage supply, and one terminal coupled to an input terminal of the voltage-to-current converter. The other input terminal of the voltage-to-current converter is coupled to the voltage reference output terminal of the programmable voltage reference circuit. Also, the voltage output terminal of the current-to-voltage converter circuit is coupled to the negative voltage input terminal of the voltage-to-current input circuit.

Abstract: A fabricated multiple layer integrated circuit in which adequate planarization is accomplished using irregularly shaped and properly spaced conductive filler features that are spaced in such a way that capacitive coupling of the conductive filler features with the active conductive regions is reduced. The overall layout area of the conductive filler features is reduced to thereby reduce capacitive coupling with active conductive above and below. In addition, a relatively small edge of the feature is closest to the active conductive in the same conductive layer thereby further reducing capacitive coupling.

Abstract: An EEPROM memory cell that includes two floating gate transistors. Each of the drain terminals of the transistors is coupled to a corresponding differential bit line. The source terminal of both transistors are coupled to a common current source or sink. Each of the control gate terminals are coupled to a corresponding word line, which may be the same as or different than the corresponding word line that the other control terminal is connected to. The floating gate transistor may be five-terminal devices that include an additional well terminal. In that case, a different set of bit lines is used to program the EEPROM memory cell as are used to read the EEPROM memory cell. While the drain terminals are coupled to the differential read bit lines, each of the well terminals is coupled to a corresponding differential program bit line.

Abstract: Amplitude detection of a baseband electrical signal. The detection may be performed by performing full wave rectification on both an in-phase portion of the electrical signal, as on a quadrature-phase portion of the electrical signal. The output signal may be generated by summing the rectified in-phases signal and the rectified quadrature-phase signal. The peak amplitude of the output signal may then be used to determine the amplitude of the original baseband signal.

Abstract: A direct conversion receiver is disclosed that converts RF signal into corresponding quadrature baseband signals without requiring conversion through an intermediate frequency. The direct conversion receiver abates local oscillator leakage, increases dynamic range and increases RF selectivity as compared to conventional direct conversion circuits. The circuit includes an in-phase branch and a quadrature-phase branch, each branch including two mixers instead of the conventional one. Each mixer is provided with balanced control signals that include a primary control signal and a complementary control signal. For each branch, the signals from the mixer pass through an operational amplifier and a low pass filter to extract the corresponding baseband signal component.

Abstract: An enhanced output impedance current mirror in which the operational amplifier includes a set of four MOSFETs having a common gate that is connected to a drain terminal of one of the differential pairs. Two of the MOSFETs reside in parallel in the current path of each of the MOSFETs of the differential pair. The differential pair MOSFET that has its drain terminal connected to the common gate also has a gate terminal that is connected to the common node between the two other MOSFETs in its current path.

Abstract: A runtime programable RS decoder that can operate on multiple pieces of data during one clock cycle in order to generate, reduce, and evaluate polynomials involved in the decoding of an RS code, and which allows a user to choose the RS code after the circuit has been implemented.

Abstract: A bandgap reference that generates a temperature stable DC voltage by using a corrective current. The corrective current is generated by a series of differential pairs that are controlled by both positive temperature shift gate voltage on one transistor, as well as a negative temperature shift gate voltage on the other transistor. As temperature changes and crosses the crossing point at which the current is split evenly through both transistors, the current change is more abrupt. The crossing points of each of the differential pairs may be appropriately selected so as to generate a high resolution corrective current. The various current contributions are summed to form the total corrective current, which tends to be quite accurate due to the abrupt crossing points. The corrective current is then fed back into the circuit so as to compensate for much of the temperature error.