Patents Assigned to Amia Corporation
  • Patent number: 6916428
    Abstract: A photo-chemical remediation of Cu-CMP waste streams basically includes the following acts: adding photo-catalyst particles into waste streams containing copper ions and organic pollutants and exposing the waste streams to UV light or sunlight to make copper ions become deposited on surfaces of the photo-catalyst particles. Whereby, the copper ions are removed from the waste streams. Meanwhile, organic and inorganic pollutants are decomposed by the photolysis capability of the photo-catalyst to make the waste streams dischargable within environmental standards to the environment.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: July 12, 2005
    Assignees: Amia Corporation, Persee Chemical Co., Ltd.
    Inventors: Yuzhuo Li, Jason Keleher, Ning Gao